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Home > Products > By Market > Electronics > JD 971-Epoxy for Electronic Devices of Low Temperature Cured
Prostech Everwide JE085-2 One Component Epoxy Adhesive

JD 971-Epoxy for Electronic Devices of Low Temperature Cured

  • Product code: JD 971
  • Manufacturer: Everwide
  • Package size:
  • Shelf Life: 6 months @-20oC ~ -5oC

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  • Description
  • Specification
  • TDS/MSDS
  • Related Article

JD971 is a one component epoxy for the application of electronic devices. This resin exhibits medium viscosity and cured under low temperature. This product exhibits excellent adhesion strength, chemical and solvent resistance. The crack and fatigue resistance of this resin are outstanding in many vibrational applications. This resin is suitable for low temperature curing and easy for working. This product is used widly in various areas in electronic devices and reinforcement.

Features

1. This product is a one component solvent-free system.
2. The hardening surface will not offer a surface oilness and poor gloss.
3. This resin offers excellent retention of electrical insulation properties under high humidity conditions.
4. The retained strength of this product after environmental test experiments is excellent.
5. This resin has excellent dimensional stability over a wide temperature range.
6. This resin complies to the 2011/65 EU RoHS regulations
7. This product complies to chlorine < 900ppm, bromine <900ppm, chlorine +bromine < 1500ppm

Typical Uncured Properties

AppearanceLiquid
ColorBlack
Viscosity 25oC, S14 50rpm, cps12,000~18,000
Thixotropic Index>1.8

Typical Cured Properties

Glass Transition Temp., (DSC)*1, oC106
CTE*4 (<Tg ) ,μm / o C64
CTE*4 (>Tg ) ,μm/ o C218
Durometer Hardness, Shore D83
Volume Resistivity, ohm-cm4.5*10^15
Surface Resistivity, ohm4.5*10^14

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    Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMISR4 Prostech Vietnam
    Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMISR4
    https://prostech.vn/electrically-conductive-adhesive-loctite-ablestik-84-1lmisr4/

    LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment.

    Outstanding Feature Product Group

    • epoxy adhesive

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    JD 971-Epoxy for Electronic Devices of Low Temperature Cured

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      JD 971-Epoxy for Electronic Devices of Low Temperature Cured

        Leave your information via Form, our Technical Support Team will contact you shortly!

        JD 971-Epoxy for Electronic Devices of Low Temperature Cured

          Leave your information via Form, our Technical Support Team will contact you shortly!

          JD 971-Epoxy for Electronic Devices of Low Temperature Cured

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