One-stop PCB Assembly
Materials & Solutions Provider
As an experienced solution provider of materials for use in joining technologies, PROSTECH is confident to enable customers to meet their goals for special PCB design, reliability, performance, cost efficiency, and sustainability.
Soldering Materials
Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for many applications.
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Underfill Adhesive
The materials have been optimized for capillary underfill and reworkability.
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Edgebond Adhesive
Dispensed on the corners or edges of the component, these materials are designed to optimize reliability and cost of assembly.
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Thermal Management Materials
Offer thermal management solutions and innovations for the next generation of electronics
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Die Attach
Offer thermal management solutions and innovations for the next generation of electronics
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Stacking
Staking is a method of anchoring the components in place, increasing the mechanical strength of electronic components
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EMI Shielding
This EMI Shielding Method is an advanced solution for increasingly modern light-weight devices
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