Product Description of HumiSeal® 1E31-G
HumiSeal® 1E31-G is a general-purpose epoxy adhesive or encapsulant featuring medium viscosity and a convenient 1:1 mix ratio. It achieves medium hardness while maintaining good flexibility, making it suitable for bonding various substrates across a wide range of applications.
Features of HumiSeal® 1E31-G
- Epoxy chemistry
- Thixotropic viscosity for Part A
- 1:1 mix ratio
- Heat-activated curing
- Silver color
- Hardness of D80
- Operating temperature range from -20°C to 150°C
Applications of HumiSeal® 1E31-G
- Solder replacement
- Bonding metals
- Bonding plastics
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
| Specification | Details |
| Chemistry | Epoxy |
| Viscosity Part A (CPs) | Thixotropic |
| Viscosity Part B (CPs) | Not specified |
| Mix Ratio | 01:01 |
| Pot Life (min) | Until exposed to heat |
| Handling Time (min) | Not specified |
| Full Cure | 2 hr @ 120°C |
| Cure Type | Heat |
| Color | Silver |
| Hardness | D80 |
| Operating Temp (°C) | -20 to 150 |
| Applications | Solder Replacement |
| Substrates | Metals, plastics |
