Product Introduction
HumiSeal® 1C49 is a high-performance, VOC-free silicone conformal coating designed for superior moisture and environmental protection on printed circuit assemblies.
HumiSeal® 1C49 Features:
- Moisture-curing formula with high build thickness (50-200 microns)
- Outstanding flexibility and UV fluorescence for inspection
- Repairable and solvent-free formulation
- Dual curing: 24 hrs @ RT or 20 min @ 76°C
- Compliant with MIL-I-46058C, IPC-CC-830, and RoHS standards
Applications:
- Protection for PCBs in harsh environments
- Ideal for assemblies requiring UV inspection capability
- Suitable for both room temperature and accelerated curing processes
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
| Property | Value |
|---|---|
| Density, per ASTM D1475 | 0.97 ± 0.03 g/cm³ |
| Min Solids Content, % by weight per Fed-Std-141, Meth. 4044 | 95% |
| Viscosity, per Fed-Std-141, Meth. 4287 | 9000 ± 1500 centipoise |
| VOC | 0 grams/litre |
| Recommended Coating Thickness | 50 – 200 microns |
| Drying Time to Handle per Fed-Std-141, Meth. 4061 | 3 – 5 hours |
| Recommended Curing Conditions | 24 hrs @ RT or 20 min @ 76°C* |
| Time required to Reach Optimum Properties | 7 days |
| Recommended Stripper | HumiSeal® Stripper 1091 |
| Shelf Life at Room Temperature, DOM | 12 months |
| Thermal Shock, 50 cycles per MIL-I-46058C | -65°C to 200°C |
| Coefficient of Thermal Expansion – TMA | 367 ppm/°C |
| Glass Transition Temperature – DSC | < -65°C |
| Storage Modulus – DMA | 408 MPa @ -40°C 1.6 MPa @ 25°C 1.4 MPa @ 80°C |
| Tensile per ASTM D-412 | 30-50 psi |
| Elongation per ASTM D-412 | 80-120% |
| Build per Dip, per ASTM D823 | 5 mils |
| Flammability, per UL94 | V-1 |
| Dielectric Withstand Voltage, per MIL-I-46058C | >1500 volts |
| Dielectric Breakdown Voltage, per ASTM D149 | 7000 volts |
| Dielectric Constant, at 1MHz and 25°C per ASTM D150-98 | 2.5 |
| Dissipation Factor, at 1MHz and 25°C per ASTM D150-98 | 0.01 |
| Insulation Resistance, per MIL-I-46058C | 5.0 x 10¹⁴ ohms (500TΩ) |
| Moisture Insulation Resistance, per MIL-I-46058C | 1.0 x 10¹⁰ ohms (10GΩ) |
| Fungus Resistance, per ASTM G21 | Passes |
