TC1050 heat spreader consists of a TPG* core encapsulated within a structural shell. The TPG provides a highly conductive path while the encapsulation material provides the structure (strength, stiffness, and coefficient of thermal expansion). Common Encapsulation Materials include:
– Aluminum (TC1050.AL)
– Copper (TC1050.CU)
– Other available encapsulations and systems include Kovar, WCu, MoCu, AlSiC, stainless steel, Ni, carbon fiber, etc.
FEATURES:
- Thermal conductivity 5x of aluminum and 3x of copper
- Low thermal interface resistance
- Lighter than aluminum
- Adjustable coefficient of thermal expansion
- Wide operating temperature range
- Mechanical load bearing
- Hermeticity higher than 10-8 atm.cc/s
- Vibration and shock resistance
- Machinable
- Platable
- Size up to 4 ft2 (0.37 m2)
APPLICATIONS:
- Heat spreader in electronic packaging
- Thermal cores for PWB’s
- Finned heat sinks
- Avionic thermal cores
- Satellite traveling wave tube (TWT) mounts
- Electronic chassis
- Cold plates in radar systems
| Material | In-Plane TC (W/m-K) | Thru-Plane TC (W/m-K) | In-Plane CTE (ppm/°C) | Specific Gravity | Specific In-Plane TC(1) |
| Aluminum | 218 | 218 | 23 | 2.7 | 81 |
| Copper | 400 | 400 | 17 | 8.9 | 45 |
| AISiC-12 | 180 | 180 | 11 | 2.9 | 62 |
| CuW | 185 | 185 | 8.3 | 15.2 | 12 |
| CVD Diamond | 1100-1800 | 1100-1800 | 1-2 | 3.5 | 310-510 |
| TPG Graphite | 1500+ | 10 | -1 | 2.3 | 650 |