Plexus® Gap Filler SL6200 is a two-component, fast curing, gel type gasket filler, with a thermal conductivity of 2.0 W/m·K. It is suitable for thixotropic and low stress applications, designed to provide enhanced thermal management for advanced vehicles battery, automotive electronics and communications equipment etc. It provides better reliability and rework ability than traditional materials. This product is high adaptable to materials, easy to use, which can eliminate assembly tolerances and protect welding spot and other components for stress-free on assembly line. This product can be applied in automation control supply and fully automatic assembly, which corresponds to the thermal interface of Industry 4.0. It can significantly reduce the overall manufacturing cost for its good rework ability and repairability.
PRODUCT CHARACTERISTICS
PRODUCT CHARACTERISTICS
Chemical Class
Silicone
Appearance(mixed)
Light Blue
Flammability, UL94 V-0
Pass
Solids by Volume, %
100
Volatility
Low
TYPICAL PROPERTIES OF UNCURED MATERIALS
Part A
Appearance
Blue
Specific gravity @25 oC
1.95
Viscosity @25 oC, cps
160,000
Part B
Appearance
White
Specific gravity @25 oC
1.95
Viscosity @25 oC, cps
160,000
Mixed
Mix Ratio, by vol, A to B
1:1
Mix Ratio, by wt, A to B
1:1
Working time @ 25oC, mins
60
Cure time @25 oC, hrs
24
TYPICAL PROPERTIES OF CURED MATERIALS Fully Cured Product (7 days at 25 oC)
Density (cured), g/cm3
1.95
Hardness, ASTM D2240, Shore OO
60
Tensile strength, ASTM D412, MPa
0.2
Strain to failure, ASTM D412, %
110
Coefficient of thermal conductivity, ISO22007-2 (Hotdisk), W/(m·K)
2.0
Volume resistivity, ASTM D257, Ω*cm
1*10^13
Dielectric strength, ASTM D149, kV/mm
>10
Service temperature, oC
-40~180
Storage: Optimal storage temperatures should range between 10 °C and 30 °C.
