• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Market > Electronics > Everwide GM 005 Photo-curing Adhesive for Glass and Metals Bonding
everwide

Everwide GM 005 Photo-curing Adhesive for Glass and Metals Bonding

  • Product code: Everwide GM 005
  • Manufacturer: Everwide
  • Package size:
  • Shelf Life: 8 months

Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

GM005 is photo-curing adhesive and fast-cure under the ultraviolet (365nm) or the visible light (436nm). After curing, the resin offers toughness, thermal shock resistance. Because of medium viscosity, the materials will not slide after curing. GM005 is suited for glass, metals and compound metals bonding.

FEATURES:

  • This resin has toughness, shock resistance and thermal shock resistance after curing under the ultraviolet.
  • This product exhibits good adhesion strength for glass, aluminum, stainless steel or compound metals.
  • The peel strength for glass and stainless steel can be above 200kg/ cm2.
  • This product complies to the 2011/65/EU RoHS regulations
 GM 005
AppearanceLiquid
ColorColorless
Viscosity 25C, S14 50 rpm, cps5,000~7,500
Solvent Content, %0
Heavy Metal Content, %0

Typical Curing Properties

Recommended Wavelength, nm310~365
Minimum Light Intensity, mW/cm2> 50
Minimum Light Energy, mJ/cm21,500~3,000

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    Yincae Wafer Level Underfill WTA-60
    Yincae Wafer Level Underfill WTA-60
    https://prostech.vn/yincae-wafer-level-underfill-wta-60/

    General Information of Yincae Wafer Level Underfill WTA-60Key Features & Technical BenefitsTypical Industrial Applications Yincae Wafer Level Underfill WTA-60 is

    Yincae Thermal Interface Material TM-150
    Yincae Thermal Interface Material TM-150
    https://prostech.vn/yincae-thermal-interface-material-tm-150/

    General Information of Yincae Thermal Interface Material TM-150Key Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Interface Material TM-150 is

    Yincae Thermal Conductive Adhesive TGP-88A
    Yincae Thermal Conductive Adhesive TGP-88A
    https://prostech.vn/yincae-thermal-conductive-adhesive-tgp-88a/

    General Information of Yincae Thermal Conductive Adhesive TGP-88AKey Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Conductive Adhesive TGP-88A is

    Yincae Solderable Conductive Adhesive TM-150E
    Yincae Solderable Conductive Adhesive TM-150E
    https://prostech.vn/yincae-solderable-conductive-adhesive-tm-150e/

    General Information of Yincae Solderable Conductive Adhesive TM-150EKey Features & Technical BenefitsTypical Industrial Applications Yincae Solderable Conductive Adhesive TM-150E is

    Similar Products

    • YINCAE-industrial-materials

      Yincae Optical Bonding WL 66L

      See details
    • YINCAE-industrial-materials

      Yincae LCD Sealant LACD 66F

      See details
    • YINCAE

      YINCAE Solder Joint Encapsulant Paste SMT 256 ED

      See details
    • Everwide FS132BL79

      See details
    Everwide GM 005 Photo-curing Adhesive for Glass and Metals Bonding

      Leave your information via Form, our Technical Support Team will contact you shortly!

      Everwide GM 005 Photo-curing Adhesive for Glass and Metals Bonding

        Leave your information via Form, our Technical Support Team will contact you shortly!

        Everwide GM 005 Photo-curing Adhesive for Glass and Metals Bonding

          Leave your information via Form, our Technical Support Team will contact you shortly!

          Everwide GM 005 Photo-curing Adhesive for Glass and Metals Bonding

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!