• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Industrial Equipment/ Robots
      • Added-value Services
      • Adhesives
      • Temporary Masking
      • Curing System
      • Converting Services
      • Tapes
      • Abrasives
      • Dispensing System
      • Material Formulation Customization
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Tape Converter Machine
      • Package Customization
      • Thermal Management
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Conformal Coatings
      • Elastomeric Materials
      • Metrology Equipment
      • Hidden
      • Potting – Encapsulant
      • Immersion Cooling Fluids
      • Plasma Treatment
      • Hidden
      • Low Pressure Molding
      • Lubricant
      • Labelling Printer
      • Hidden
      • Electronic Glob-top
      • Impregnating resin
      • Robotic & Automation
      • Hidden
      • Electronic Dam & Fill
      • Insulation
      • Hidden
      • Hidden
      • Electronic Staking/Fixing
      • Thinner Liquid
      • Hidden
      • Hidden
      • Electronic Underfill
      • Labelling Printing
      • Hidden
      • Hidden
      • EMI Shielding
      • Industrial Coating
      • Hidden
      • Hidden
      • Cleaner Degreaser
      • Maintain and Repair
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Other Industrial Materials
      • Hidden
      • Hidden
      • Primer and Adhesion Promoter
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • tesa
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternative
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Industrial Equipment/ Robots
      • Added-value Services
      • Adhesives
      • Temporary Masking
      • Curing System
      • Converting Services
      • Tapes
      • Abrasives
      • Dispensing System
      • Material Formulation Customization
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Tape Converter Machine
      • Package Customization
      • Thermal Management
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Conformal Coatings
      • Elastomeric Materials
      • Metrology Equipment
      • Hidden
      • Potting – Encapsulant
      • Immersion Cooling Fluids
      • Plasma Treatment
      • Hidden
      • Low Pressure Molding
      • Lubricant
      • Labelling Printer
      • Hidden
      • Electronic Glob-top
      • Impregnating resin
      • Robotic & Automation
      • Hidden
      • Electronic Dam & Fill
      • Insulation
      • Hidden
      • Hidden
      • Electronic Staking/Fixing
      • Thinner Liquid
      • Hidden
      • Hidden
      • Electronic Underfill
      • Labelling Printing
      • Hidden
      • Hidden
      • EMI Shielding
      • Industrial Coating
      • Hidden
      • Hidden
      • Cleaner Degreaser
      • Maintain and Repair
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Other Industrial Materials
      • Hidden
      • Hidden
      • Primer and Adhesion Promoter
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • tesa
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternative
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Application > Adhesives > ET5104 – Two-part Epoxy for Bonding tiles and stones

ET5104 – Two-part Epoxy for Bonding tiles and stones

  • Product code:
  • Manufacturer: Prostech
  • Package size:
  • Shelf Life: 24 months
Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

ET5104 is a two component, easy to use, epoxy based tile adhesive and grout. It is suitable for all types of tiles and stones on the floor and wall. It is especially recommended for hygiene-sensitive areas and also areas that require sterile conditions.
When mixing two components, it forms a smooth, creamy & thixotropic paste, which is easy to apply, easy to clean, and easy to maintain. At the same time, it also provides high mechanical and chemical resistance properties. The resultant is, an easy to-use, high-durability grout, which is available in an attractive range of colors.

Features

  • For grout joints between 2 mm – 12 mm.
  • Easy to mix, creamy consistency high productivity grout.
  • Can be applied on wall and floor.
  • Highly thixotropic – non-sag formula can be used as both grout and adhesive on floor & wall.
  • Easy to apply
  • Early flexural properties
  • High resistance to abrasion
  • High Compressive strength
  • Low water absorption results in watertight joints
  • Resistance to stain & chemicals.
  • Hygienic in service & would not allow bacterial growth
  • Low VOC – Over curing full reaction takes place.
  • Available in 12 widely used colors.
Properties ET5104
Physical State A – colored resin paste
B – Neutral color hardener   paste
Pot life > 80 min, 25°C
Full cure 7 days
Temperature range 0°C – 80°C
Mix density 1.58 g/cc

ANSI 118.3 SPECIFICATION

Classification Code Test Characteristics As per ANSI ET5104
Water cleanability Spreadable and cleanable after mixing 80 min 95 min
Setting time initial setting time >120 min 175 min
Service setting time <7days 6 days
Shrinkage After 7- day cure <0.25% 0.06%
Sag in vertical joints In 10 mm tile gap No change No change
Bond strength to quarry tile Shear bond strength after 14 days >6.9 MPa 8.5
Compressive strength After 7 days >24.2 MPa 33
Tensile strength After 7 days >6.9 MPa 8.7
Thermal shock resistance Shear bond strength immersion and hot and cold water bath >3.5 MPa 4.2

CONFORMATION TO ISO 13007-1 AS PER ADHESIVE

Classification Code Test Characteristics As per ISO 13007 ET5104
R2 – Improved reaction
resin adhesive
Shear adhesion strength >2 MPa 8
Shear adhesion strength after water immersion >2 MPa 6.5
Shear adhesion strength after thermal shock >2 MPa 5.2
Open time: tensile adhesion strength >0.5 MPa after not less than 20 min 3.5
T – Slip resistance Vertical slip resistance <0.5 mm No slip

 

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    potting ev charging point
    Adhesives Solution for EV Charging Point
    https://prostech.vn/adhesives-solution-for-ev-charging-point/

    LCD Screen BondingPotting Adhesives for EV Charger ConnectorsThreadlocking for FastenersGasketing (Sealing) EV Charging PointConformal Coatings for PCB ProtectionThermal Management for

    Fire Retardant Adhesive for Safety and Protection
    https://prostech.vn/fire-retardant-adhesive-for-safety-and-protection/

    What is Fire Retardant Adhesive?Types of Fire Retardant AdhesivesKey Benefits of Fire Retardant AdhesivesChoosing the Right Fire Retardant AdhesiveProduct RecommendationsPermabond

    Carpet Adhesives Solution for Automotive & Flooring
    https://prostech.vn/carpet-adhesives-solution-for-automotive-flooring/

    Meeting Industry Demands with High-Performance Carpet Adhesives1. Keep production lines running smoothly2. Improve end-of-life recyclability3. Solvent-Free, Environmentally Friendly Technologies4. Prioritize

    Reactive Hot Melt Adhesives (PUR Hot Melt)
    Adhesive Solutions for Automotive Interior Lamination
    https://prostech.vn/adhesive-solutions-for-automotive-interior-lamination/

    Trends & Challenges in Automotive Interior Lamination Adhesive Solutions for Interior Lamination1. Reactive Hot Melt Adhesives (PUR Hot Melt)2. Pressure

    Similar Products

    • HumiSeal® UV23 - Prostech

      HumiSeal® 2C52 Thixotropic Silicone Gel

      See details
    • HumiSeal® UV23 - Prostech

      HumiSeal® 2E11 Epoxy

      See details
    • HumiSeal® Urethane Adhesive 2A20

      HumiSeal® Urethane Adhesive 2A20

      See details
    • HumiSeal® UV23 - Prostech

      HumiSeal® Urethane Adhesive 2A20HV

      See details
    ET5104 – Two-part Epoxy for Bonding tiles and stones

      Leave your information via Form, our Technical Support Team will contact you shortly!

      ET5104 – Two-part Epoxy for Bonding tiles and stones

        Leave your information via Form, our Technical Support Team will contact you shortly!

        ET5104 – Two-part Epoxy for Bonding tiles and stones

          Leave your information via Form, our Technical Support Team will contact you shortly!

          ET5104 – Two-part Epoxy for Bonding tiles and stones

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!