Product Description
- This specialized product is a two-component, high-temperature epoxy adhesive meticulously engineered for the most demanding applications across semiconductor, hybrid, fiber optic, and medical industries.
- As one of the most acclaimed EPO-TEK® brand offerings, it boasts a global reputation for outstanding performance and unwavering reliability in critical bonding scenarios.
- Capable of forming near-hermetic and UHV seals, it excels in sensor devices, high-temperature packaging, and down-hole petrochemical fiber optic sensors operating above 200°C.
- Ideal for diverse electronic assembly tasks, including use as a dielectric layer in capacitors, laminating PZT ferroelectrics, impregnating copper coil windings, and structurally bonding hard-disk drive components.
- The formulation ensures excellent light transmission across a broad spectrum (800-1600 nm), making it perfect for sealing fibers into ferrules and active alignment in optical pathways.
Key Features
- Two-component system
- High-temperature performance
- Suitable for semiconductor, hybrid, fiber optic, and medical applications
- Passes NASA low outgassing standard ASTM E595
- Meets Telecordia 1221 for fiber optic applications
- Excellent optical transmission properties (800-1600 nm)
- Available in single component frozen syringe option
- Reliable for near-hermetic and UHV seals
- Resists extreme field conditions (>200°C)
EPO-TEK® 353ND Advantages & Application Notes
- NASA approved, low outgassing epoxy – http://outgassing.nasa.gov/cgi/sectionb/sectionb_html.sh
- Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMS devices; flip chip underfill.
- Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high-temperature packaging
- Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions
- Fiber optic adhesive designed to meet Telecordia 1221 – suggested applications:
- Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range
- Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
- Medical suggested applications:
- Potting Fiber Optic bundles into SST ferrules for light guides and endoscopes, resisting sterilization cycles of autoclave, ETO, gamma, H202 plasma.
- Certified to USP Class VI Biocompatibility Standards for medical implants; adhesive for catheter devices, including stents and guide wires
- Electronics Assembly suggested applications:
- Used as a dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices
- Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
- Structural grade epoxy found in hard disk drive devices; bonding of SST metals, Kapton, and magnets
物理性能
| 颜色 | A组分：透明/无色 B组分：琥珀色 |
| 外观 | 可倾倒液体 |
| 粘度（@ 50 RPM/23°C） | 3,000 – 5,000 cPs |
| 玻璃化转变温度（Tg） | ≥ 90°C（动态固化 20—200°C /ISO 25分钟；升温 -10—200°C @ 20°C/分钟） |
| 热膨胀系数（CTE） | |
| Tg以下 | 54 x 10^-6 in/in/°C |
| Tg以上 | 206 x 10^-6 in/in/°C |
| 邵氏D硬度 | 85 |
| 搭接剪切强度 @ 23°C | >2000psi |
| 芯片剪切强度 @ 23°C | ≥ 15 Kg / 5,100 psi |
光学性能 @ 23°C
| 折射率 | 1.5694 @ 589 nm |
| 光谱透射率 | > 50% @ 550 nm |
| > 95% @ 700 – 2500 nm |
电气与热性能
| 介电常数 @ 23°C（1 KHz） | 3.17 |
| 体积电阻率 @ 23°C | ≥ 1.8 x 10^13 Ohm-cm |
| 介质损耗因数 @ 23°C（1 KHz） | 0.005 |
