• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Manufacturer > ITW Performance Polymers > Devcon® > Devcon® Tru-BondTM PSA LOCA 3000 UV/Visible Light Cure Adhesive
Devcon® Tru-BondTM PSA LOCA 3000 UV/Visible Light Cure Adhesive Prostech Vietnam

Devcon® Tru-BondTM PSA LOCA 3000 UV/Visible Light Cure Adhesive

  • Product code: 3000
  • Manufacturer: ITW Performance Polymers
  • Package size:
  • Shelf Life:
Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

Devcon® Tru-BondTM PSA LOCA products provide a unique patent pending chemistry engineered to bond the glass cover
lens to a touch panel sensors and touch panel assemblies to the LCD or OLED module. The product is applied as a liquid and cured using a single exposure step to form a fully polymerized pressure sensitive adhesive (PSA). 

This single light exposure design delivers consistent strengths under the inked glass areas and through to the clear lens portions of the assembly. The Devcon® Tru-Bond™ PSA LOCA product line can bond to a wide range of materials including glass, PMMA, ABS, PP, PE, PC and many more surfaces.

PHYSICAL PROPERTIES (uncured)

PHYSICAL PROPERTIES (uncured) 
Chemical ClassAcrylic
Appearance (uncured)Clear Liquid
ComponentsSingle-Requires no Mixing
Viscosity (@25°C)3,000 cps (Brookfield RV Spindle 2, 6 rpm)
Specific gravity (@25°C)1.03

PHYSICAL PROPERTIES (cured)

PHYSICAL PROPERTIES (cured) 
Curing conditionLED365 lamp, illumination intensity=100 mW/cm2, total energy=5,000 mJ/cm2
Shore hardness, ASTM D224045oo
Specific gravity (@25°C)1.03
Volume shrinkage, %3.68
Refractive Index (@25°C, ISO 489)1.49
Tg, °C-41
Elongation, ASTM D638, %800
Tensile strength, ASTM D638, MPa0.20
Dielectric constant (@100kHz)4.0
Storage modulus (@25°C, KPa)37

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    Yincae Wafer Level Underfill WTA-60
    Yincae Wafer Level Underfill WTA-60
    https://prostech.vn/yincae-wafer-level-underfill-wta-60/

    General Information of Yincae Wafer Level Underfill WTA-60Key Features & Technical BenefitsTypical Industrial Applications Yincae Wafer Level Underfill WTA-60 is

    Yincae Thermal Interface Material TM-150
    Yincae Thermal Interface Material TM-150
    https://prostech.vn/yincae-thermal-interface-material-tm-150/

    General Information of Yincae Thermal Interface Material TM-150Key Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Interface Material TM-150 is

    Yincae Thermal Conductive Adhesive TGP-88A
    Yincae Thermal Conductive Adhesive TGP-88A
    https://prostech.vn/yincae-thermal-conductive-adhesive-tgp-88a/

    General Information of Yincae Thermal Conductive Adhesive TGP-88AKey Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Conductive Adhesive TGP-88A is

    Yincae Solderable Conductive Adhesive TM-150E
    Yincae Solderable Conductive Adhesive TM-150E
    https://prostech.vn/yincae-solderable-conductive-adhesive-tm-150e/

    General Information of Yincae Solderable Conductive Adhesive TM-150EKey Features & Technical BenefitsTypical Industrial Applications Yincae Solderable Conductive Adhesive TM-150E is

    Similar Products

    • YINCAE-industrial-materials

      Yincae Optical Bonding WL 66L

      See details
    • YINCAE-industrial-materials

      Yincae LCD Sealant LACD 66F

      See details
    • devcon-5-minute

      Devcon 5 Minute Epoxy Gel 14265 – 50 ml 的报价

      See details
    • devcon-5-minute

      Devcon 5分钟环氧凝胶 14240

      See details
    Devcon® Tru-BondTM PSA LOCA 3000 UV/Visible Light Cure Adhesive

      Leave your information via Form, our Technical Support Team will contact you shortly!

      Devcon® Tru-BondTM PSA LOCA 3000 UV/Visible Light Cure Adhesive

        Leave your information via Form, our Technical Support Team will contact you shortly!

        Devcon® Tru-BondTM PSA LOCA 3000 UV/Visible Light Cure Adhesive

          Leave your information via Form, our Technical Support Team will contact you shortly!

          Devcon® Tru-BondTM PSA LOCA 3000 UV/Visible Light Cure Adhesive

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!