• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Market > Consumer Products > Cyberbond U323
H. B. Fuller EA6107

Cyberbond U323

  • Product code: U323
  • Manufacturer:
  • Package size:
  • Shelf Life: 6 months

Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

Cyberlite U323 is a UV-curable adhesive specially formulated for use in clamshell bonding applications.

FEATURES:

  • UV-Curable Acrylate
  • Viscosity: 1500 +/- 500
  • Color: Clear
  • Set Time* < 5 seconds
  • Strength PSI (PETG): 600 – 1000 psi
  • Temperature Range: -55°C to 120°C
  • * Approximate set time @ 50mW/cm2. Results will vary.

APPLICATIONS:

  • Using in clamshell bonding applications.
Physical Properties – Monomer (Uncured) 
Base Compound Modified Acrylate
Appearance Light Straw Liquid
Viscosity1500 +/- 500 cps
Specific Gravity1.1 g/cc
Flash Point> 95°C
Storage Condition8°C to 21°C in darkness
RoHS-CompliantYes
Physical Properties – Polymer (Cured) 
Setting Time*< 5 second
Full Cure Time24 hours
AppearanceColorless Solid
Tack-Free Surface?Yes
Elongation70 %
Shore Hardness72    (Shore A)    30      (Shore D)
Optimal Wavelength300         to          420       nm

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    Yincae Wafer Level Underfill WTA-60
    Yincae Wafer Level Underfill WTA-60
    https://prostech.vn/yincae-wafer-level-underfill-wta-60/

    General Information of Yincae Wafer Level Underfill WTA-60Key Features & Technical BenefitsTypical Industrial Applications Yincae Wafer Level Underfill WTA-60 is

    Yincae Thermal Interface Material TM-150
    Yincae Thermal Interface Material TM-150
    https://prostech.vn/yincae-thermal-interface-material-tm-150/

    General Information of Yincae Thermal Interface Material TM-150Key Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Interface Material TM-150 is

    Yincae Thermal Conductive Adhesive TGP-88A
    Yincae Thermal Conductive Adhesive TGP-88A
    https://prostech.vn/yincae-thermal-conductive-adhesive-tgp-88a/

    General Information of Yincae Thermal Conductive Adhesive TGP-88AKey Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Conductive Adhesive TGP-88A is

    Yincae Solderable Conductive Adhesive TM-150E
    Yincae Solderable Conductive Adhesive TM-150E
    https://prostech.vn/yincae-solderable-conductive-adhesive-tm-150e/

    General Information of Yincae Solderable Conductive Adhesive TM-150EKey Features & Technical BenefitsTypical Industrial Applications Yincae Solderable Conductive Adhesive TM-150E is

    Similar Products

    • YINCAE-industrial-materials

      Yincae Optical Bonding WL 66L

      See details
    • YINCAE-industrial-materials

      Yincae LCD Sealant LACD 66F

      See details
    • TUV7130 UT UV Cure Silicone Encapsulant

      See details
    • Prostech GLT-132BL89-Tin-free, moisture curing, modified silicone adhesive

      Gluditec GLT322 单组分环氧胶粘剂

      See details
    Cyberbond U323

      Leave your information via Form, our Technical Support Team will contact you shortly!

      Cyberbond U323

        Leave your information via Form, our Technical Support Team will contact you shortly!

        Cyberbond U323

          Leave your information via Form, our Technical Support Team will contact you shortly!

          Cyberbond U323

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!