Chem-Wik Rosin Flux Desoldering Braid 80-BGA-5

Chem-Wik Rosin Flux Desoldering Braid 80-BGA-5 offers the state of the art in desoldering technology. Soder-Wick® is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.

FEATURES

• Requires little or no post solder cleaning
• No corrosive residues
• Optimized weave design for faster wicking and heat transfer
• Halide free
• Minimal risk of heat damage to components and circuit boards

APPLICATIONS

• Thru-hole Components
• Surface Mount Device Pads
• BGA Pads
• Micro Circuits
• Terminals
• Lugs and Posts
• Identification Script