Product Description
Elantas Bectron® SG 75L2-30 / SG 79L5-30
SG 75L2-30 when mixed with 79L5-30 will cure at room temperature to form a trans- parent gel in about 48 hours. Cure can be accelerated with heat. Elasticity and dielectric properties of the final gel re- main largely stable in a wide range of temperatures, between -50°C and +180°C.
Features of Bectron® SG 75L2-30 / SG 79L5-30
- Addition cure system
- Curing at room temperature
- Long working time
- Cure can be accelerated with heat
- Long term thermal resistance
- Elasticity
- Low Hardness
- Classified UL 94 V0
Application of Bectron® SG 75L2-30 / SG 79L5-30
Bectron® SG 75L2-30 cross-linked with Bectron® SG 79L5-30 is specifically designed for protection of elec- tronic components against mechanical stress and vi- bration when high thermal conductivity is needed. Possibility of accelerated cure at high temperature al- lows use in mass production manufacturing lines
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SYSTEM SPECIFICATIONS
Property | Conditions | Method | Bectron® SG 75L2-30 | Bectron® SG 79L5-30 | Units |
Viscosity | 25°C | DIN 53019 | 11000 ÷ 14500 | 7500 ÷ 9000 | mPas |
Specific gravity | 20°C | EN/DIN/ISO 2811-1 | 1.73 ÷ 1.83 | 1.69 ÷ 1.79 | g/ml |
Penetration | 1h at 120°C | M 77 | 20 ÷ 40 | mm*10 |
TYPICAL SYSTEM CHARACTERISTICS
Property | Bectron® SG 75L2-30 | Bectron® SG 79L5-30 |
Colour | Beige | Blue |
Shelf Life | 12 months | 12 months |
TYPICAL THERMAL PROPERTIES OF THE CURED PRODUCT
Test | Value |
Thermal Conductivity [W/m.K] | 0.90 |
UL 94 classification | V0 |