The rising demand to miniaturize camera assemblies and increase reliability requires manufacturers to find the suitable adhesive material for their productions
Struggling to find matching materials for your camera module applications, this article will be the first one in the series to help you solve this problem
In camera module, we have some basic applications that make up almost the whole industry: FPC reinforcement, House bonding, IR filter bonding, Lens bonding, Barrel fixation, VCM assembly, Active alignment, Process liner, etc
FPC reinforcement (substrate)
This application typically requires flexibility and bend resistance. Basic types of FPC reinforcement range from PI, FR4 and Stainless Steel
Bonding the lens holder to the substrate requires different adhesive characteristics depending on the type of camera module being assembled.
For fixed-focus cameras, a traditional thermal-cure, nonconductive house bonding adhesive is the preferred approach. More advanced auto-focus modules, however, require a different technique – particularly as pixels and lens quantity increase.
IR filter bonding
Bonding of the IR filter to the substrate requires a strong, yet flexible, material to accommodate fast, high-adhesion curing with the ability to absorb stress.
Suitable adhesives for this application require rapid UV cure and handling strength, a high thixotropic index to reduce liquid migration and unwanted contamination, and the ability to enhance load-bearing and shock-absorbing characteristics
Lens barrel bonding
To attach lens into barrel, fast curing UV adhesives with low surface tack and low outgassing are required to reduce risk of contamination.
UV/thermal cure adhesives provide instant fixturing during alignment. Low temperature thermal cure and excellent environmental resistance ensure permanent, precise alignment
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