LOCTITE ABLESTIK 2035SC, Proprietary Hybrid Chemistry, Die Attach, Non-Conductive Adhesive
LOCTITE ABLESTIK 2035SC is non-conductive die attach adhesive has been formulated for use in high throughput die-attach applications. This material is designed to minimize stress and resulting warpage between the dissimilar surfaces.
FEATURES:
- Non-conductive
- Single component
- Fast cure
- Low cure temperature
- Low stress
RECOMMENDED APPLICATIONS:
- Compact Camera Module – Die attach
Cure Type | Heat |
Appearance | Red |
Viscosity (Brookfield) 25°C, 5 rpm | 11,000 |
Glass Transition Temperature (Tg) | 120 |
Modulus @ 25°C | 2,500 |
CTE Below Tg | 54 |
CTE Above Tg | 128 |
Recommended Cure | 90 sec. @ 110°C |