3M™ Water-Soluble Wave Solder Tape 5414 has a water-soluble poly-vinyl alcohol-backing and a synthetic watersoluble adhesive. It is designed for use in masking gold finger areas on printed circuit boards during the wave soldering and then will dissolve completely away during typical in-line aqueous cleaning processes.
FEATURES
- No adhesive residue after removal
- Low static upon liner release and when taping circuit board
- Moisture barrier packaging plus desiccant
- Humidity extremes do not affect tape properties
- Easy manual and machine application
- Die-cuttable
APPLICATIONS
Masking of gold finger areas on printed circuit boards for wave soldering.
| Property | Values | Unit | Test Method |
| Adhesion to Stainless | 4 | oz/in | ASTM D3330 |
| 0.4 | N/cm | ASTM D3330 | |
| Elongation at break | 334 | % | ASTM D3759 |
| Temperature range | -40 to 240 | °C | 3M test method |
| -40 to 464 | °F | 3M test method | |
| Tensile strength at break | 105.1 | N/cm | ASTM D3759 |
| Total tape thickness without liner | 2.1 | mils | ASTM D3652 |
| 0.053 | mm | ASTM D3652 | |
| Shelf Life | 12 | months | – |
