TG-NSP36K is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic devices. This material is designed to optimize flow from a dispensing system and also provides a low thermal impedance for enhanced cooling.
FEATURES
- Excellent thermal conductivity 4.5W/mK
- Fully cured and reworkable
- Ideal for wide range of gaps
- Fully supported optimisation of dispense systems
APPLICATIONS
- Consumer electronics
- Power supplies and semi-conductors
- Automotive
- LED lighting
| Property | TG-NSP36K | Unit | Tolerance | Test Method |
| Colour | Light grey | – | – | Visual |
| MIx ratio, by weight | One component | – | – | – |
| Extrusion rate, 2.5mm orifice, 50psi, 25˚C | 2.0 | g/min | – | – |
| Temperature Range | -40 to 200 | ˚C | – | – |
| Flow Test, 45˚ incline | Non flow | mm | – | – |
| Specific Gravity 25˚C | 3.1 | – | – | ASTM D792 |
| Thermal Conductivity | 4.5 | W/mK | – | ASTM D5470 |
| Volatile Content | <0.5 | % | – | ASTM E595 |
| Oil Bleeding 100˚C/100h | 50 | mm | – | – |
| Shelf Life | 12 | months | – | – |
