NSP-35 is a one-part, fully cured non-silicone gap filler with has been designed to reduce the time to market and overall cost of ownership for production processes.
NSP-35 is provided fully cured, ready for dispensing which gives a significantly simpler design process and allows products to be brought to market with reduced lead-times. This product is also ideally suited for automation and T-Global offers complete turn-key solution to support this. This product provides:
• A low thermal impedance, when compared to traditional gap filler, for a wide range of gaps, which allows a greater degree of design flexibility to be achieved
• Proven reliability under conditions of thermal cycling, shock and vibration
• Deflects easily under low pressures which decreases stress on fragile or delicate components
FEATURES
- Easily dispensable from manual, semi-automatic or fully automatic systems
- Full turn-key support from T-Global
- Low thermal impedance
- High thermal conductivity
- Ultra-low compression forces
- High tack on most surfaces and reworkable
- Proven long term reliability
- Available in cartridges (30cc, 50cc, 75cc, 180cc, 360cc, 600cc,) and pails (2.1kg, 5kg, 9kg, 25kg, 36kg)
APPLICATIONS
- Consumer electronics
- Set-top boxes
- IP routers
- ECUs
- Memory and Power modules
| Property | TG-NSP35 | Unit | Test Method |
| Colour | Grey | – | Visual |
| Flow Rate, 30cc syringe with no tip, 2.54mm oriface 621 Kpa, | 60 | g/min | T-Global |
| Specific Gravity | 3 | – | ASTM D792 |
| Typical bond line thickness | 0.025 | mm | T-Global |
| Thermal Conductivity | 3.5 | W/mk | ASTM D5470 |
| Coefficient of Thermal Expansion | 150 | ppm/K | ASTM E831 |
| Operating Temperature Range | -40 – 200 | ˚C | T-Global |
| Volume resistivity | 2.15 x 1015 | Ohm-cm | ASTM D257 |
| Flammability Rating | V-0 (pending) | – | UL94 |
| ROHS Compliant | Yes | – | T-Global |
| D4-10 | 0 | PPM | ASTM E595 |
| Shelf Life | 18 | months | TG |
