FEATURE:
- Leadfree solder paste
- 20 – 38µm
- Sn-3,0Ag-0,5Cu
- 217° – 220°C
- No clean
APPLICATION:
This solder paste has perfect cohesion properties which is necessary for pin in paste applications. The solder wets the lead inside the through hole perfect.
- Chemical Composition (wt%)
| Chemical element | Main constituents | Impurities | ||||||
| Sn | Ag | Cu | Pb | Sb | Bi | Au | In | |
| Standard | Remainder | 3.0±0.2 | 0.5±0.1 | <0.05 | ≦0.10 | ≦0.05 | ≦0.05 | ≦0.10 |
| Chemical element | Impurities | |||||||
| Al | As | Cd | Fe | Ni | Zn | |||
| Standard | ≦0.001 | ≦0.03 | ≦0.002 | ≦0.02 | ≦0.01 | ≦0.001 | ||
See more in TDS file