At Prostech, we distribute leading brands of thermal interface materials, including T-global, Jonestech, AOK, Momentive, Henkel, and Lipoly. Not only offer high-quality thermal interface materials but also advanced machinery solutions such as pick & place thermal pad and thermal conductive fluid dispensing systems.

We understand our customers’ challenges and are committed to providing the qualifed and most effective solutions for specific applications.

WHAT ARE THERMAL INTERFACE MATERIALS?

A thermal interface material (TIMs) describes any material that is inserted between two parts in order to enhance the thermal coupling between these two components. A majority of applications are related to the heat dissipation of the system. The TIM is inserted between the heat producing device (the heat source) and the heat dissipation device (heat sink).

Challenges manufacturers face include:

  • Numerous types of TIMs
  • A wide variety of products within each type
  • Limited technical knowledge to select the right solution
  • Difficulty finding a reliable supplier

THERMAL INTERFACE MATERIALS THEORY

Heat will always be transferred from a hot medium to a cold medium:

WHY DO WE NEED TIMS?

The rough machined surfaces of a heat sink and heat source result in limited contact points.

Bringing the rough surfaces closer creates insulating air gaps, causing contact resistance and thermal barriers.

A thermal interface material (TIM) fills voids, replaces air with a higher conductivity material, and improves surface contact for better heat transfer.

Why thermal management is necessary?

BENEFITS OF THERMAL INTERFACE MATERIALS

Reduce thermal impedance across gaps

Replace air with more thermally conductive materials

Conform to surface irregularities

 

Electrical isolation

Attachment

TYPES OF THERMAL INTERFACE MATERIALS

Common types of TIMs

What is thermal pad?

Thermal Pads (also called thermally conductive pads) are a preformed square or rectangle of solid material (often silicone-based) commonly used on the underside of the heatsink to aid the conduction of heat away from the component being cooled (such as CPU or another chip) and into the heatsink.

 

FEATURES

  • 0.5 – 24 W/mK thermal conductivity
  • 0.2 – 12 mm thickness
  • 2 – 10 kV/mm breakdown voltage
  • Silicone or Silicone free

BENEFITS

  • Soft & conformable to fit uneven & rough surface area
  • Providing low stress on components during assembly while providing shock-dampening abilities
  • Providing easier handling abilities for simple application & automated assembly
  • Offering puncture, shear & tear resistance for added device resilience
  • Cut to the desired size and shape

FEATURES

  • Typically composed of a carrier material, such as polymer, embedded with thermally conductive fillers like ceramic or metal particlesThermal conductivities of around 1-2 W/mK
  • Thin material

BENEFITS

  • Electrically insulating
  • Good adhesion is perfect for fastening mechanical components
  • Low thermal impedance
  • Easy to apply
  • Cut to the desired size and shape
 

What is thermal tape?

Thermal tapes are adhesive materials providing excellent heat transfer along with reliable mechanical fastening. Thermal tapes are typically composed of a carrier material, such as polymer, embedded with thermally conductive fillers like ceramic or metal particles.

What is Phase Change Material?

Phase change material (PCM) refers to a substance that changes the state of a substance and provides latent heat without changing the temperature. The process of transforming physical properties is called a phase change process. At this time, the phase change material will absorb or release a large amount of latent heat.

 

FEATURES & BENEFITS

  • Low volatility substitute for thermal grease
  • Non-reinforced version or with PI, fiberglass
  • No mess with thixotropic property, filling uneven gap without flowing out of the interface
  • Simplify application process
  • Low thermal impedance

FEATURES

  • Typically made from natural or synthetic graphite
  • Excellent thermal conductivity in the horizontal XY-plane (up to 1800 W/m-K)
  • Can be laminated with adhesive layer
  • Cut to desired size & shape

BENEFITS

  • Can handle high temperatures and thermal cycling, this makes them suitable for use in high-power applications
  • Highly flexible and conformable
  • Simply process
 

What is Graphite/Graphene sheet?

Thermally Conductive Graphite is a TIM with high thermal conductivity and a thin graphite film structure (thickness measured in microns). Graphite is formed of a layered structure with strong covalent bonds within the layers, and weak van der Vaals bonds connecting the layers.

What is Thermal Grease?

Thermal grease is a type of material that is used to improve heat transfer between two surfaces that are in contact with each other. Thermal grease is typically made up of a mixture of thermally conductive fillers, such as aluminium oxide, silicon dioxide, and boron nitride, suspended in a carrier fluid, such as a silicone oil or water. The fillers are chosen to maximize thermal conductivity while minimizing electrical conductivity to avoid shorting out the electronics.

 

FEATURES & BENEFITS

  • High thermal conductivy
  • High viscosity
  • Silicone & non-silicone based
  • Can be messy and difficult to remove if it gets on other parts of the device
  • Fills any microscopic gaps and improves the contact area between the surfaces
  • Offer low thermal impedance and resistance

FEATURES

  • Either silicone or non-silicone based
  • Non-silicone putties tend to have good stability and longevity compared to silicone formulas and are advisable in silicone sensitive applications
  • It can be messier to apply and more difficult to remove

BENEFITS

  • A soft, mouldable material that is used to fill gaps and uneven surfaces
  • Strong thermal conductivity and electrical insulation properties
  • Offers good resistance to thermal cycling and maintains strong levels of thermal conductivity
  • Suited for high volume application
 

What is Thermal Gel/Putty?

Thermal putty is a soft, mouldable material that can be used to fill gaps and uneven surfaces between the heat source and the heat sink. This helps to improve the thermal conductivity between the two surfaces and improves the efficiency of heat dissipation.

What is Thermal Gap Filler?

Gap fillers are thermally conductive gap filling liquid materials designed to enhance thermal performance and enable easier dispensing application for your high-volume manufacturing operations.

 

FEATURES

  • Two-part material
  • Are frequently utilized in markets such as automotive, where high reliability is required

BENEFITS

  • Ultra-low modules for minimal stress during assembly
  • Excellent conformability to intricate geometries
  • Single solution for multiple applications
  • Efficient material usage
  • Customizable flow characteristics

INDUSTRIES

Automotive ADAS

Automotive E-mobility

Datacom

Power Conversion

5G Telecom Infrastructure

Aerospace

LED Lighting

Consumer Electronics

Industrial Automation

PROSTECH’s TIMS OPTIONS

Comprehensive range of thermal interface materials tailored to meet diverse application needs

Advanced materials ensure optimal thermal management, enhancing performance and reliability for your products

The product is certificated to RoHS, Reach standard

 

Our engineers offer expertise in selecting the best thermal interface materials for specific applications

Advanced machinery solutions such as pick & place thermal pad and dispensing systems

Global delivery service for customer

CHOOSING THERMAL INTERFACE MATERIALS

Prostech’s thermal interface materials are engineered to suit a variety of applications. However, the specific interface material you require will vary based on your manufacturing needs. Choosing the appropriate thermal management solution is crucial for:

  • Optimizing heat dissipation
  • Extending the life of components
  • Upholding performance of devices
  • Eliminating the risk of failure and performance drops
 

Selecting the right thermal interface material for your application depends on several factors, including:

  • Heat dissipation requirements
  • Adhesive qualities needed in assembly
  • Whether a solid or liquid is more applicable
  • The size of the gap that needs to be filled
  • Gap topography and surface
  • Component stress level requirements
  • Physics, including application temperature and structure

TIMs basic guideline and their efficiency for PCB thermal management

FEATURED COLLABORATIONS

Momentive

Momentive is renowned for its innovation and quality in the chemical and materials sector, offering a diverse range of products

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Shiu Li Lipoly

Founded in 2005, Shiu Li Technology has established itself as a leading thermal management manufacturer, developing high-performance thermal solutions for

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We take pride in providing thermal interface material from some of the world’s most renowned brands, including t-Global, Gluditec, Vietape, AOK, Everwide,… We are dedicated to understanding your needs, recommending the most suitable products, ensuring a seamless supply chain, and delivering prompt support.

Discover our selection of world-class material brands here, or reach out to us to find the ideal solution for your application.

AUTOMATED DISPENSING SOLUTION

Prostech has established a strong equipment partnership with Gluditec, a leading provider of advanced industrial machinery. Through this collaboration, Prostech offers cutting-edge equipment solutions, including dispensing machines and pick & place thermal pad systems, ensuring efficient and precise application of materials.

Pick & Place System

The Pick and Place Machine is an advanced solution designed to automate and streamline the installation process of heat dissipation silicone pads.

Thermal Conductive Fluid Dispensing System

The system is used for dispensing TIMs are highly viscous, abrasive, stringy, and challenging to dispense

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WHY THERMAL MANAGEMENT IS NECESSARY?

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