FEATURES
- Flux Content 9.5%
- Solder Powder Size: 25 – 45 (μm).
- Straight lines of solder paste are printed on to a JIS-2 type substrate then reflowed.
- The reflowed solder is examined with a stereo microscope at 30X magnification.
- No more than 2 solder balls larger than one fifth the size of the pattern gap is allowed per gap.
| Appearance | Colour | Comparison with Limit Specimen |
| Weight | Net Weight | -0, +0.01 (kg) |
| Solder Powder Size | 25/45 | 90 (wt%) |
| Metal Composition | Sn | 63.0±0.5 (wt%) |
| Pb & Impurities | Rest | |
| Characteristics | Flux Content | 9.5±0.5 (wt%) |
| Solder Balling Test (*Almit Method) | Comparison with Limit specimen | |
| Viscosity (Spiral type,10rpm, 25ºC) | 150-300 (Pa·s) | |
| Solderability on Cu Plate | Comparison with Limit specimen | |
| Dryness | Chalk powder should be easily removed from each test specimen. |