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Solder Paste Sn63 HM1-RMA V14L

  • Product code: HM1-RMA V14L
  • Manufacturer: Almit
  • Package size: 500g / 700g / 1000g
  • Shelf Life: 6 months
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FEATURES

  • Flux Content 9.5%
  • Solder Powder Size: 25 – 45 (μm).
  • Straight lines of solder paste are printed on to a JIS-2 type substrate then reflowed.
  • The reflowed solder is examined with a stereo microscope at 30X magnification.
  • No more than 2 solder balls larger than one fifth the size of the pattern gap is allowed per gap.
AppearanceColourComparison with
Limit Specimen
WeightNet Weight -0, +0.01 (kg)
Solder Powder Size25/4590 (wt%)
Metal CompositionSn63.0±0.5 (wt%)
Pb & ImpuritiesRest
CharacteristicsFlux Content9.5±0.5 (wt%)
Solder Balling Test
(*Almit Method)		Comparison with
Limit specimen
Viscosity
(Spiral type,10rpm, 25ºC)		150-300 (Pa·s)
Solderability on Cu PlateComparison with
Limit specimen
DrynessChalk powder should
be easily removed
from each test specimen.

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