Product desciption
Gluditec GLT322 One Component Epoxy Adhesive is a one component epoxy adhesive for electronic devices bonding. This product exhibits good adhesion strength. This resin can be fast cured at low temperature and is suited for different kinds of materials bonding, it is especially good for plasitcs bonding. The durability level of this product is very high and this resin can pass many environmental test experiments. This product is well suited for heat sensitive components bonding, such as memory cards and C-MOS assembling.
Features of Gluditec GLT322 One Component Epoxy Adhesive
- This product is solvent-free and non-volatile system.
- The hardening surface will not exhibit a surface oiliness .
- Cured product has poor gloss.
- This resin offers excellent retention of electrical insulation
properties under high humidity conditions. - This resin offers excellent chemical resistance and solvent
resistance. - It is highly vibrate-resist at ordinary temperature.
- This resin has excellent dimensional stability over a wide
temperature range. - This product complies to the 2011/ 65/EU RoHS regulations.
- This product complies to chlorine < 900ppm, bromine <
900ppm, chlorine + bromine < 1500ppm.
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
Typical Uncured Properties
| Appearance | Liquid |
| Color | Black |
| Viscosity 25oC, S14 5rpm, cps | 128,000~192,000 |
| Thixotropic Index | 4~6 |
| Filler grain size, um | 2~5 (Max<10) |
| Filler ratio, % | 23 |
Typical Curing Properties
| Pot Life 25oC, day | 2 |
|
Recommended Cure Time 80°C, min |
60 |
|
Recommended Cure Time 90°C, min |
50 |
| Recommended Cure Time 100°C, min | 40 |
| Recommended Cure Time 120°C, min | 30 |
| Recommended Cure Time 150°C, min | 20 |
Typical Cured Properties
| Glass Transition Temp.,(DSC), °C | 132 |
| Glass Transition Temp.,(TMA), °C | 152 |
| CTE*8(<Tg), μm/m/ °C | 48 |
| CTE*8(>Tg), μm/m/ °C | 162 |
| Volume Shrinkage, % | 2.9 |
| Thermal Conductivity, W/mK | 0.5 |
| Thermal Resistance, m2K/W | 0.006 |
| Volume Resistivity, ohm-cm | 4.5*10^15 |
| Surface Resistivity, ohm | 4.5*10^14 |
| Dielectric Constant 100HZ | 5.6 |