Thermally Conductive Silicone Adhesive Silcool TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. Silcool TIA350R silicone adhesive cures quickly upon exposure to heat, and adheres well to a wide variety of substrates.
FEATURES:
- Good thermal conductivity
- Low temperature, fast cure
- Easy to use one component formulation
- Electrically insulative.
- Primerless adhesion to many substrates
- Non-corrosive to metals
APPLICATIONS:
- Thermal Interface Material between dies and heat spreaders.
- Adhesive for use between various heat sources and heat dissipation devices.
UNCURED PROPERTIES
Appearance | Gray Paste | |
Viscosity (23ºC) | Pa.s | 67 |
CURED PROPERTIES
Density (23ºC) | 3.1 g/cm³ |
Hardness Shore A | 77 |
Tensile Strength | 1.6 MPa |
Elongation | 20% |
Adhesion Strength | 1.0 MPa |
Volume Resistivity | 4.8×10^6 |
Dielectric Strength (60Hz) | 20 kV/mm |
Thermal Conductivity | 3.5 W/m.K |
Thermal Resistance (BLT:60 μ m) | 77 |