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L37-3L Thermal Conductive Pad

  • Product code: L37-3L
  • Manufacturer: t-Global
  • Package size:
  • Shelf Life:

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L37-3L is a silicone based thermal gap filler which has been formulated for exceptionally low silicone bleed. This allows the product to be used in certain low silicone critical applications, such as optical devices, HDDs and high end communication devices. L37-3L can be provided in a number of different formats including standard sheets, log-rolls and custom die cuts of various thicknesses. L37-3L can also be provided with one or two sided adhesive for ease of manufacture.

FEATURES

  • One side natural tack with smooth surface and one exceptionally durable
  • High dielectric breakdown voltage

APPLICATIONS

  • Electronic components: IC, CPU, MOS
  • LED, M/B, P/S, Heat Sink
  • LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
  • DDR II Module, DVD Applications, Hand-set applications, etc.
Property  L37-3L Unit Tolerance Test Method
Colour  Yellow – – Visual
Reinforcement Carrier  Fibreglass
mesh		 – – –
Thickness (Available thickness
range)		 0.5 – 10  mm – ASTM D374
0.0196 – 0.394 inch – ASTM D374
Thermal Conductivity  1.5 W/mK ± 0.17 ASTM D5470
Flammability Rating  V-0 – – UL 94
Dielectric Breakdown Voltage  15 kV/mm ± 0.1 ASTM D149
Weight Loss ‹0.2 % – ASTM E595
Density 2.4 g/cm³ ± 0.2 ASTM D792
Working Temperature -45 to 200 ˚C – –
Volume Resistance ›10¹¹ Ohm-cm – ASTM D257
Elongation  20 % ± 0.2 ASTM D412
Hardness 85 Shore A ±3 ASTM D2240

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