JONES Thermal Grease 21-430SF is a silicone-free based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.
FEATURES AND BENEFITS
Thermal Conductivity: 3.0W/m·k|Moderate Viscosity|Low Thermal Resistance|High Thermal Conductivity|Silicon-free| Solvent-free.
APPLICATIONS
CPUs (Notebooks, PCs, Servers)|LED Solid State Lighting|GPUs.
21-430SF TYPICAL PROPERTIES |
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Properties |
Typical Properties |
Test Method |
Thermal |
Thermal Conductivity (W/m·K) |
3.0 |
ASTM D5470 |
Thermal Resistance@40psi (°C.cm^2/W) |
0.153 |
ASTM D5470 |
|
Operating Temperature Range (°C) |
-40~125 |
JONES Test Method |
|
Physical |
Composition |
Ceramic & Silicone-free |
/ |
Color |
Grey |
Visual |
|
Typical Minimum Bondline Thickness(μm) |
25 |
JONES Test Method |
|
Viscosity@20rpm (Pa·s) |
150 |
ASTM D2196 |
|
Density (g/cm^3) |
2.3 |
ASTM D792 |
|
Electrical |
Breakdown Voltage (KV AC/mm) |
>12.0 |
ASTM D149 |
Volume Resistivity (Ohm·cm) |
10^12 |
ASTM D257 |
|
Dielectric Constant @1MHz |
4.8 |
ASTM D150 |
|
Regulatory |
Flame Rating |
V0 |
UL94 |