JONES 21-430SF Silicone – Free Thermal Grease is a silicone-free based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.
FEATURES AND BENEFITS of JONES 21-430SF Silicone – Free Thermal Grease
Thermal Conductivity: 3.0W/m·k｜Moderate Viscosity｜Low Thermal Resistance｜High Thermal Conductivity｜Silicon-free｜ Solvent-free.
APPLICATIONS of JONES 21-430SF Silicone – Free Thermal Grease
CPUs (Notebooks, PCs, Servers)｜LED Solid State Lighting｜GPUs.
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
21-430SF TYPICAL PROPERTIES | |||
| Properties | Typical Properties | Test Method |
Thermal | Thermal Conductivity (W/m·K) | 3.0 | ASTM D5470 |
Thermal Resistance@40psi (°C.cm^2/W） | 0.153 | ASTM D5470 | |
Operating Temperature Range (°C) | -40~125 | JONES Test Method | |
Physical | Composition | Ceramic & Silicone-free | / |
Color | Grey | Visual | |
Typical Minimum Bondline Thickness(μm) | 25 | JONES Test Method | |
Viscosity@20rpm (Pa·s) | 150 | ASTM D2196 | |
Density (g/cm^3) | 2.3 | ASTM D792 | |
Electrical | Breakdown Voltage (KV AC/mm) | >12.0 | ASTM D149 |
Volume Resistivity (Ohm·cm) | 10^12 | ASTM D257 | |
Dielectric Constant @1MHz | 4.8 | ASTM D150 | |
Regulatory | Flame Rating | V0 | UL94 |
