According to The Climate Neutral Group, data centers typically consume almost 3% of the world’s electricity, while cooling is estimated to account for nearly 40% of the total energy consumed by data centers (McKinsey). For a data center with an annual energy expenditure of $1 million, cooling alone could cost up to $400,000, significantly contributing to overall data center costs.
Therefore, without proper thermal management, inefficiencies in heat dissipation can lead to:
- Higher energy bills: Inefficient cooling increases energy usage.
- Shortened equipment lifespan: Overheating accelerates wear and tear on servers.
- Downtime risks: Excessive heat can lead to system failures.
As data centers become smaller with higher server densities, the challenge of heat dissipation grows exponentially. The implementation of advanced thermal management materials is becoming more and more important.
How Thermal Management Materials Reduce Heat?
Thermal management materials are designed to optimize heat dissipation, ensuring that critical components maintain stable operating temperatures. Their effectiveness lies in their ability to enhance cooling efficiency, reduce energy consumption, and prolong equipment life. Here are several thermal management solutions Prostech offers and how they helps reduce a significant amount of heat:
 | Micro thermal interface coatingsMicro-thermal interface coating solutions, known for their ultra-thin and durable design, enable effective heat transfer between pluggable optical modules (POMs) and their corresponding heat sinks. Certain MicroTIMs can dissipate heat at a rate of 0.33 °C per watt, delivering up to a 5°C reduction for modules operating at 15 watts. |
 | Phase-Change Materials (PCM)Phase-change materials are especially well-suited for Layer 1 and Layer 2 ASIC and FPGA devices, where efficient heat dissipation is essential for optimal performance. Offering a clean and hassle-free alternative to thermal grease, they are favored in environments that demand both high performance and reliability. |
 | Thermal GreasesThermal grease facilitates efficient heat transfer by filling air gaps, which are ineffective at conducting heat. It maintains stability across a broad temperature range (-40°C to +200°C) while offering excellent thermal conductivity, electrical insulation, and durability against environmental stressors. |
 | Thermal GelThermal gels are air-free, providing exceptional heat transfer capabilities. Certain single-component liquid gels deliver process versatility, minimize stress on components, and achieve thermal conductivities of up to 6.0 W/m-K. |
 | Thermal PadsFeaturing low modulus and high thermal conductivity, these pads are ideal for integrated circuits (ICs) that do not need larger heat sink attachments. Their flexibility allows for low-stress thermal management while streamlining the application process. |
 | Thermal conductive adhesives (TCA)TCAs exhibit a wide range of thermal conductivity values, generally ranging from 0.1 W/m·K to 60 W/m·K, which vary based on the type of filler material, its concentration, configuration, and the thermo-mechanical properties of the adhesive matrix. |
For detailed information, refer to the article: Thermal Interface Material (TIMs) Solutions for Data Centers
Optimizing ROI of Thermal Management Materials to Reduce Data Center Costs
Small changes in the materials used in manufacturing data center servers can lead to significant savings in both capital and operating expenses. By enhancing the efficiency of heat transfer and improving the durability of servers, these advancements break the cycle of escalating data center costs:
- Energy Savings: These materials improve heat transfer efficiency, reducing the workload on HVAC systems. For instance, improving thermal efficiency by 10% could lower cooling costs by $40,000 annually in a $1 million energy budget
- Extended Equipment Lifespan: By maintaining optimal operating temperatures, servers last longer. Extending server life by even 1 year can prevent a $500,000 equipment replacement
- Reduced Downtime Risks: Improved thermal performance lowers the likelihood of overheating, reducing downtime by 50% or more. This translates to avoiding potential losses of hundreds of thousands of dollars annually.
Future-Proofing for Sustainable Data Center
Many organizations are also leveraging thermal management to meet sustainability goals, such as reducing carbon footprints. Lower energy consumption directly translates into fewer emissions, an increasingly critical metric for businesses aiming to align with ESG (Environmental, Social, and Governance) standards.
Contact us for thermal management solution to optimize data center costs
Prostech understands the technical issues related to thermal management materials in data centers. We offer comprehensive solutions, including consulting, materials, and automated adhesive application equipment. We have a global warehousing network to assist customers with logistics procedures. Positioned as a comprehensive supplier, Prostech is constantly striving to become a trusted partner for manufacturers around the world. Contact us by leaving your information below:
