Home > Products > By Manufacturer > Momentive > High Conductivity TMP-FX Laminate

High Conductivity TMP-FX Laminate

  • Product code: TMP-FX
  • Manufacturer: Momentive
  • Package size:
  • Shelf Life:
Request Quote Request Sample

Momentive Performance Materials Inc. offers a unique heat conducting laminate product that contains a TPG* core (>1500 W/m-K) and either a metal or carbon fiber coating for advanced thermal management applications. TMP-FX laminate is an excellent thermal management product to consider for use as:
– Heat spreader
– Thermal strap
– Heat sink fins

FEATURES:

  • High thermal conductivity
  • Fast thermal response
  • Low profile
  • Light weight
  • Flexibility
  • Formability
  • Durability
  • Solderability

APPLICATIONS:

  • Power electronic packaging
  • RF & microwave packaging
  • High power LED
  • Lighting
  • Mobile devices

 

 

TMP-FX

Coating

Material

 Coating

Thickness

Inch (mm)

Laminate Thermal

Conductivity

(W/m-K)

Surface Finish

(Ra)

µin (μm)

Dimension Tolerance

Inch (mm)

Operating

Temperature

(°C)
x-y  z
TMP-FX (Aluminum)      0.004 (0.1) >1200  24 (0.6) ±0.005 (±0.13) ±0.002 (±0.05) -55 to +125
TMP-FX (Copper)      0.004 (0.1) >1250  24 (0.6) ±0.005 (±0.13) ±0.002 (±0.05) -55 to +125
TMP-FX (Tin)       0.002 (0.05) >1350 135 (3.0) ±0.005 (±0.13) ±0.002 (±0.05) -65 to +150

TDS:Download

Get MSDS

    Please leave your information and we'll get back to you shortly!







    Outstanding Feature Product Group