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HFS- 20 series

  • Product code: HFS-20
  • Manufacturer: Shenzhen HFC
  • Package size:
  • Shelf Life: 2 years

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HFC HFS-20 is a high-efficiency thermally conductive gasket with good thermal conductivity and low thermal resistance, which can effectively fill the gap between the heating end and the cooling end, and achieve efficient heat transfer between the heating part and the cooling part Amplitude reduces interface thermal resistance. At the same time, the high-efficiency heat sink can also be used under lower stress conditions to avoid damage to chips, PCBs and other components from mounting stress. The product is extremely technical and usable, and can be used in devices such as photovoltaic modules and Netcom that require.

FEATURES:
●High thermal conductivity and low thermal resistance
●Low stress assembly
●Good thermal stability
●Multiple thickness options, wide range of applications
●Slight color difference on the surface is a product characteristic and does not affect performance

PROPERTIES

Items Parameter Unit Test Method
Color Gray Black – Visual
Specification 120*120 mm ASTM D 5947
Thickness Range 0.25~3 mm ASTM D 374
Hardness 65 Shore 00 ASTM D 2240
Density 3.4 g/cc ASTM D 792
Tensile Strength ≥0.1 Mpa ASTM D 412
Elongation ≥100 % ASTM D 412
Tear strength ≥0.5 N/mm ASTM D 624
Compression Ratio ≥40(@50Psi) % ASTM D 575
Operating Temperature -50~150 ℃ IEC 60068-2-14

THERMAL CHARACTERISTIC

Thermal conductivity 16.0 W/m·K ASTM D 5470
Thermal resistance ≤0.2(@30%&2mm) ℃in2/W ASTM D 5470

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