H48-2 is a silicone based thermal pad which has been designed for both efficient heat transfer away from critical devices and ease of manufacture. H48-2 can be provided in a range of formats and thicknesses, such as standard sheets, rolls or die cuts. Additionally, H48-2 may be provided with either one of two sided adhesive to further facilitate manufacturing processes.
FEATURES
Good thermal conductivity
Ultra-soft and high compressibility
Natural tack
Easy to assemble
Good insulator
Shock and vibration absorber
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink LCD, TV, Notebook PC, PC Telecom Device, Wireless, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
Property
H48-2
Unit
Tolerance
Test Method
Colour
Dark Red
–
–
Visual
Thickness (Available thickness
range)
0.1 – 10
mm
–
ASTM D374
0.012 – 0.7874
inch
–
ASTM D374
Thermal Conductivity
2.2
W/mK
±0.22
ASTM D5470
Flammability Rating
V-0
–
–
UL 94
Dielectric Breakdown Voltage
5
kV/mm
±0.5
ASTM D149
Weight Loss
<1
%
–
ASTM E595
Density
2.43
g/cm3
±0.2
ASTM D792
Working Temperature
-40 to 200
°C
–
–
Volume Resistance
>1011
Ohmcm
–
ASTM D257
Elongation
282
%
–
ASTM D412
Tensile Strength
7
Kgf/cm2
±2
ASTM D412
Hardness
25
Shore A
±2.5
ASTM D2240
Shelf Life
36
months
–
–
Shelf Life with adhesive
(can be requalified for a further 12)
