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Home > Products > By Application > Thermal Management > Solid Material > Thermal Pad > H300MAS series

H300MAS series

  • Product code: H300MAS
  • Manufacturer: Shenzhen HFC
  • Package size:
  • Shelf Life: 2 years

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  • Specification
  • TDS/MSDS
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HFC high-frequency thermal electromagnetic wave absorption sheet H300MAS is a kind of dual-function composite material that combines thermal management and electromagnetic wave absorption functions. It not only has good elasticity and compressibility, but also has strong surface viscosity and excellent operation, applied between integrated circuits, heat sinks, other heatconducting components and metal substrates, in addition to solving the problem of heat conduction in materials, it can also suppress unnecessary electromagnetic energy coupling, resonance and EMI problems caused by electromagnetic interference. In the era of high-frequency transmission ,the product has broad application prospects.

FEATURES:

●Double advantages of electromagnetic wave absorption and heat conduction
● Low thermal resistance
● Good surface compatibility and self-adhesive
● High fire resistance
● Application under low pressure
● Excellent electrical insulation performance

 

PROPERTIES

Items Parameter Unit Test Method
Color Gray Black – Visual
Thickness Range 0.25~3 mm ASTM D 374
Hardness 30~55 Shore C ASTM D 2240
Density 3.8 g/cc ASTM D 792
Tensile Strength ≥0.1 Mpa ASTM D 412
Elongation ≥150 % ASTM D 412
Tear strength ≥0.6 N/mm ASTM D 624
Flammability rating V-0 – UL-94
Operating Temperature -40~160 ℃ IEC 60068-2-14

THERMAL CHARACTERISTICS

Thermal conductivity .0 W/m·K ASTM D 5470
Thermal resistance ≤1.3(@20psi&2mm) ℃in2/W ASTM D 5470

ELECTRICAL PROPERTIES

Breakdown voltage ≥2 kV /mm ASTM D 149
Volume resistivity ≥10^12 Ω.cm ASTM D 257
Dielectric constant ≥5 @1MHz ASTM D 150
Dielectric loss ≤0.1 @1MHz ASTM D 150

 

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    WHY THERMAL MANAGEMENT IS NECESSARY?
    https://prostech.vn/why-thermal-management-is-necessary/

    Up to 55% of failures on electronic circuit boards are caused by heatWhat causes temperature increase in an electronic package?So

    Outstanding Feature Product Group

    • thermal management
    • thermal pad

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