Bostik Born2Bond™ UV-CIPG has been developed to meet the demands of modern manufacturing processes: high efficiency, automated processes, complex designs, smaller size, lightweight, less waste, and water/dust proof.
With products that offer excellent elasticity and easy dispensability, along with exceptional quality, durability and strength, Born2Bond™ UV-CIPG is emerging as a top choice for industry players.
FEATURES:
- Highest flexibility on the market
- No cracks even with 50% compression
- Extremely flexible and tough, it does not crack even when compressed or deformed
- High thixotropic indexes enable the creation of complex gaskets on flat surfaces or shallow grooves
- Immediate curing using UV light
- Enables micro-dispensing
BENEFITS:
- Enable fully-automated application by robot
- Reduce labour and material costs
- Ensure reliable waterproofing
RECOMMENDED APPLICATION:
- Wearable Devices
- Smart watches
- Security cameras
Part Number | AU521C | |
Viscosity (mPa.s / 25°C) | 0.5rpm | 1,400,000 |
5.0rpm | 230,000 | |
Thixotropy index (0.5 rpm / 5 rpm) | 6.1 | |
Density | 23°C | 1.2 |
Strength at break (23°C) | MPa | 4.0 |
Elongation (23°C) | % | 1,800 |
Hardness (Shore) | A | 17 |
00 | 69 | |
Compression set 70°C /22Hrs. (%) | 25% | 12 |
50% | 12 | |
Hydrolysis resistance 85°C x 95%RH | 200h |