3M™ Hot Melt Adhesive 3797 is a temperature resistant, low viscosity adhesive which flows easily into small areas for effective coverage and protection, ideal for electrical potting. This 100% solids thermoplastic adhesive also provides a quick 30-second open bead time for potting even at depth.
FEATURES
- Hot melt adhesive ideal for potting of electrical and electronic components
- Low viscosity provides high flow rates for excellent coverage
- Ball and ring tested – adhesive exhibits good temperature resistance after application
- 30 second bead open time makes for effective potting at depth
- For use with 3M™ Hot Melt Applicator PG II, allowing for fast-paced production
APPLICATIONS
- Electrical potting even at great depth
- Securing wires to resist strain and breakage
- Bundling wires for convenient handling
- Rigidizing components on printed circuit boards to add stability during assembly, shipping and end use
- Terminating coils
- Cable strain relief
Property | Values | Unit |
Density | 0.92 | g/cm3 |
Flashpoint | 570 | °F |
Viscosity @ 375°F | 2,650 | cps |
Shear Strength | 350 | psi |
Peel Strength | 10 | pwi |
Shelf Life | 2 | years |