Non-Silicone Thermal Pad or called Non-Silicone Based Gap Fillers are used to fill gaps of 0.1-10mm between surfaces and lower thermal resistance by excluding air from the interface. These materials are used when the presence of silicone oils could be detrimental to product performance.
On the other hand, Non-Silicone Thermal Pad are still generally used under compression of approx. 25-40% as Silicone Based one which helps to reduce pressure to electronic components.
This kind of material usually used in Telecommunications and Medical Market due to their special demands.
Non-silicone Thermal Pad
t-Global T68 Artificial Graphite Pad
- Product code: T68
- Manufacturer: T-Global
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TGZNSG Hybrid Thermal Pad
- Product code: TGZNSG
- Manufacturer: T-Global
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LIPOLY N-TEM53 Non-Silicone Thermal Conductive RF Absorber Pad
- Product code: N-TEM53
- Manufacturer: Shiu Li Lipoly
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LIPOLY N-TEM52 Non-Silicone Thermal Conductive Pad
- Product code: N-TEM52
- Manufacturer: Shiu Li Lipoly
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LIPOLY TEM96C Thermal Conductive RF Absorber Pad
- Product code: TEM96C
- Manufacturer: Shiu Li Lipoly
- Package size: 160.00mm x 160.00mm
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LIPOLY TEM96B Thermal Conductive RF Absorber Pad
- Product code: TEM96B
- Manufacturer: Shiu Li Lipoly
- Package size: 160.00mm x 160.00mm
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LIPOLY TEM96A Thermal Conductive RF Absorber Pad
- Product code: TEM96A
- Manufacturer: Shiu Li Lipoly
- Package size: 160.00mm x 160.00mm
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LiPOLY N-TEM54 Non-Silicone Thermal Conductive
- Product code: N-TEM54
- Manufacturer: Shiu Li Lipoly
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JONES 21-1500 Carbon Fiber Thermal Pads
- Product code: 21-1500
- Manufacturer: Jones Tech
- Package size: 2” X 2” (45mm X 45mm)
- Shelf life: 12 tháng
JONES 21-1800 Carbon Fiber Thermal Pads
- Product code: 21-1800
- Manufacturer: Jones Tech
- Package size:
- Shelf life: 12 tháng