Overview of Low Pressure Molding for Cables, PCB and USBs
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Low Pressure Molding is a method of creating a plastic cover that protects electronic circuit boards, wires, USBs or other sensitive electronic components. The molding process requires a hardened steel mold and a quantity of hot melt material (hot melt adhesive). The molding device melts the material and feeds it into the mold, then shapes the cover by cooling the material immediately. The plastic cover after being formed will help protect electrical cables, circuit boards or sensitive components from humidity and vibration, thereby increasing reliability of the product.
Currently, production has shifted to using specialized Low Pressure Molding Equipment. These devices make the production process faster, save more materials, and improve production efficiency.
Let’s learn more about Low Pressure Molding with Prostech in this video!
Prostech is currently one of the leading units in Vietnam in providing low pressure molding equipment and materials. If you have any questions, please contact us for advice:
