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Home > Products > By Application > Adhesives > Structural Adhesive > Acrylic Structural Adhesive > Everwide NC 884-8 One Component Acrylic Adhesive for Die Bonding

Everwide NC 884-8 One Component Acrylic Adhesive for Die Bonding

  • Product code: Everwide NC 884-8
  • Manufacturer: Everwide
  • Package size: 5ml/ 10ml/ 30ml/ 300ml/ 1L
  • Shelf Life: 8 months

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  • Description
  • Specification
  • TDS/MSDS
  • Related Article

NC884-8 is one component of acrylic resin adhesive for electronic devices. This product has fast curing properties. It is able to reduce the working time and increase efficiency at the same time. This resin develops strong structural bonds and has excellent dimensional stability. This product exhibits high thermal conductivity, and it can be suitable for more applications.

FEATURES:

  • The hardening surface will not exhibit a surface oiliness. It has good insulation.
  • This product has high thixotropic properties. When using, this product will not be stringing. It has more applications.
  • This resin has high Tg, high thermal conductivity and low shrinkage. It is suited for underfill applications.
  • This product complies with the 2011/65/EU RoHS regulations.
  • This product complies to chlorine < 900ppm, bromine <900ppm, chlorine + bromine < 1500ppm.
AppearanceLiquid
ColorPink
Viscosity 25oC, S14 50rpm, cps10,000~16,000
Viscosity 25oC, S14 5rpm, cps30,000~50,000
Thixotropic Index2.2
Average Particle Size, μm30
Maximum Particle Size, μm50
Pot Life 25oC, hr24
Through Cure Time 100oC, seconds120
Through Cure Time 110oC, seconds90

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    Underfills for reinforcing Components on PCBs
    https://prostech.vn/underfills-for-reinforcing-components-on-pcbs/

    What is Underfill? Why underfill?Three types of Underfills 1. Full Underfill2. Corner bonding3. Edge bonding Materials and equipment for Underfill EquipmentMaterials  What is Underfill? 

    Materials for Underfill and Encapsulation for PCB assembly
    https://prostech.vn/materials-for-underfill-and-encapsulation-for-pcb-assembly/

    UnderfillEncapsulation Underfill Underfills can be used to help reinforce electronic components and minimize stress. They also offer excellent protection of

    Underfill Application in Camera Module Assembly
    https://prostech.vn/underfill-application-in-camera-module-assembly/

    Importance of underfill in Camera ModuleKey Material PropertiesRelated Products The camera module industry has come into focus as smartphone, tablet

    Outstanding Feature Product Group

    • Underfill

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    Everwide NC 884-8 One Component Acrylic Adhesive for Die Bonding

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      Everwide NC 884-8 One Component Acrylic Adhesive for Die Bonding

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        Everwide NC 884-8 One Component Acrylic Adhesive for Die Bonding

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          Everwide NC 884-8 One Component Acrylic Adhesive for Die Bonding

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