Bectron® PK 5542 is a one component resin system which cures to form a soft polyurethane duroplastic with high thermal resistance. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including some thixotropic character while maintaining superior tem- perature resistance & stability.
Heating the resin releases the encapsulated polyiso- cyanate resulting in a polyaddition reaction to give a soft duroplastic cured material.
APPLICATIONS
- The cured Bectron® PK 5542 is a soft duroplastic suitable for chemical, shock and vibration protection of delicate components exposed to high temperature conditions.
- Bectron® PK 5542 is used for the partial or selective coating of SMDs and other components groups on printed circuit boards and ceramic substrates. It can also be applied as a casting/potting resin for elec- tronic components and sensors, automotive electron- ics, plugs etc, up to temperature of 150°C
- The viscosity is moderate with slight thixotropic prop- erties for selective thick coating of components or potting of PCB’s or hybrids in housings.
Properties of component as supplied
|
Property |
Condition |
Value |
Unit |
|
Viscosity, DIN 53019 |
D=15 s-1, 23°C |
5,000 ± 1,000 |
mPas |
|
Density, DIN EN ISO 2811-2 |
23°C |
1.40 ± 0.05 |
g/cm³ |
|
Shelf life |
23°C |
6 |
months |
Thermal properties of cured compound
|
Property |
Condition |
Value |
Unit |
|
Coefficient of thermal expansion, Beck Test M 56 |
-20°C to + 90°C |
150 x 10-6 |
K-1 |
|
Thermal conductivity, DIN 52616 |
23°C |
0,35 |
W/mK |
Mechanical properties of cured compound
|
Property |
Condition |
Value |
Unit |
|
Glass transition temperature, IEC 61006 |
– |
Not measureable |
°C |
|
Shore hardness, ISO 868 |
23°C |
70 ± 10 |
Shore A |
