Momentive’s thermally conductive gap fillers are non-slumping, dispensable materials that can be applied to gaps to create a heat path. These non-adhesive curing type TIMs form a soft, stress-absorbing thermal interface. In addition to filling gaps in electronic components, they are also applied to flat or high-profile 3-dimensional surfaces as a cured-in-place thermal pad or as a pump-out resistant alternative to greases.
FEATURES:
- High thermal conductivity (10.1 W/m.K)
- Dispensable formulation that conforms to complex shapes.
- Soft, stress-absorbing
- Electrically insulative
- Repairable
- Ability to remain in place under thermal cycling scenarios
✓ No-sag
✓ No crack
✓ No voiding
| Properties | TIA2101GF |
| Type | 2 Part Curing Ge |
| Color | Pale Pink |
| Viscosity (23oC) Pa.s (Part A) | 820 |
| Viscosity (23oC) Pa.s (Part A) | 830 |
| Pot Life h | 1 |
| Cure Time (@70C) min | 60 |
| Thermal Conductivity W/m.K | 10.1 |
| Thermal Resistance2 (BLT) mm².K/W | 22 |
| Volume Resistivity MΩ.m | 3.0×10^13 |
| Volatile Siloxane (D4-D10) ppm | <100 |
