TGZNSG is a dry to touch thermal interface pad formulated with non-silicone thermal grease. It was developed to offer the low thermal resistance in a thermal interface without the mess of grease. TGZNSG consists of a 2-mil aluminium substrate that is coated on each side with specially formulated grease and natural to touch. It offers
very high transfer to devices where gaps of 4 – 6 mil is required to be filled.
FEATURES
Natural tacky but dry to touch
Minimal force (<15 psi) for interface contact
TIM pad with all unique advantages of thermal grease
Low thermal resistance
Excellent for cold applications
Allows for total wetting of microscopic voids
Can be supplied in rolls or custom die-cuts
APPLICATIONS
Power modules
IGBTs, DC-DC converter modules
Solid state relays, Power MOSFETs and RF components
