TGZNSG is a dry to touch thermal interface pad formulated with non-silicone thermal grease. It was developed to offer the low thermal resistance in a thermal interface without the mess of grease. TGZNSG consists of a 2-mil aluminium substrate that is coated on each side with specially formulated grease and natural to touch. It offers
very high transfer to devices where gaps of 4 – 6 mil is required to be filled.
FEATURES
- Natural tacky but dry to touch
- Minimal force (<15 psi) for interface contact
- TIM pad with all unique advantages of thermal grease
- Low thermal resistance
- Excellent for cold applications
- Allows for total wetting of microscopic voids
- Can be supplied in rolls or custom die-cuts
APPLICATIONS
- Power modules
- IGBTs, DC-DC converter modules
- Solid state relays, Power MOSFETs and RF components
- Power amplifiers, ASICs and digital components
- Customised heat dissipating surfaces
| Property | TGZNSG | Unit | Test Method |
| Colour | Grey | – | Visual |
| Thickness (Available thickness range) | 0.15 | mm | ASTM D374 |
| 0.06 | inch | ASTM D374 | |
| Thermal Conductivity | 3 | W/mK | ASTM D5470 |
| Thermal Resistance @ 70psi & 36°C | 0.07 | C-in^2/W | ASTM D5470 |
| Operating Temperature | -20 to 200 | °C | – |
| Shelf Life, 25°C | 12 | months | – |
