Plasma treatment is gradually becoming a preferred technology in the production of electronic devices. Manufacturers of electronic circuit boards often face various issues, such as poor adhesion of component surfaces and oxidation layers hindering the soldering process. With its superior surface treatment capabilities, plasma technology effectively addresses these challenges. Let’s explore the applications of plasma in electronic device manufacturing in this article.
1. Plasma application in the conformal coating pretreatment
Conformal coating is a method used to protect electronic circuit boards from environmental factors such as moisture, dust, and temperature. Contaminants like fingerprints, flux residues, and dirt on the surface prior to coating, if not properly cleaned, can reduce adhesion and affect the circuit’s performance in the future. Therefore, for the coating to achieve optimal effectiveness, surface treatment before coating is crucial.
Plasma Effect: Plasma generates free radicals and ions from gases like oxygen or argon, which help break down contaminants and clean surfaces by disrupting their chemical bonds. Plasma also increases surface energy by forming functional groups (such as hydroxyl, carboxyl) on the surface, allowing for better adhesion of the coating.
Read more about the working mechanism of plasma at: What is Plasma Surface Treatment and how does it work on the surface?
Advantages of Plasma Surface Treatment for Circuit Boards:
- Cleans the surface of the circuit board, reducing the risk of corrosion and other negative effects caused by contaminants
- Activates the surface of both the circuit board and the components soldered or adhered to it
- Increases surface energy to improve adhesion of the conformal coating
Previously, surface cleaning and adhesion enhancement processes relied on liquid chemicals like primers, AP, and IPA solvents. However, these chemicals have limitations that plasma can overcome by:
- Providing an environmentally friendly cleaning process without harmful volatile solvents
- Enabling surface treatment of components with complex structures that are hard to reach
- Treating surfaces of small, delicate conductive, semiconductor, or insulating components that could be damaged during handling
- Reducing costs per treatment
- Adding value to the final product by using modern technology
Read more: Benefits of using Plasma in Surface Treatment Process
2. Plasma application in the encapsulation process
In the encapsulation process, plasma removes contaminants, enhancing the adhesion between the component and the encapsulating material (such as epoxy or silicone).
Additionally, plasma provides heat to evaporate residual moisture on the component surface, effectively eliminating unwanted moisture and gases, which helps reduce the occurrence of air bubbles in resins like silicone or epoxy.
Furthermore, plasma generates functional groups on the component surface, increasing the wetting ability of the resin and improving coverage. This ensures that the resin fills all gaps, preventing air bubbles and providing a secure encapsulation, thus offering better protection for the component.
3. Plasma application in PCB soldering
In reality, contaminants on the surface of circuit boards can lead to issues like solder joint lifting or warping, which reduce quality and increase production costs. Therefore, cleaning the surface before soldering is crucial to ensure strong adhesion between the tin and the circuit board.
Plasma removes contaminants, oxides, and grease by generating free radicals and ions that break down impurities. These ions and free radicals apply mechanical and chemical effects on the surface, resulting in effective cleaning.
Plasma increases surface energy and creates functional groups, enhancing the adhesion of the soldering material to the circuit board, minimizing issues like solder joint lifting or warping.
4. Plasma application for oxide layer removal
The oxide layer on metal surfaces can hinder the soldering process and reduce component performance. Plasma removes the oxide layer by using gases like argon, oxygen, or hydrogen to generate ions and free radicals that react with the oxide, cleaning it and converting it into easily volatile products.
Plasma not only cleans the oxide layer but also increases the surface energy of materials like circuit boards, heat sinks, and DBC (Direct Bonded Copper), thereby improving the adhesion of solder layers and other materials.
Thus, it is clear that plasma technology plays a crucial role in optimizing electronic device manufacturing processes. Plasma not only helps clean and prepare surfaces effectively but also enhances the quality of encapsulation, soldering, and oxide layer treatment. As a result, it improves the performance and reliability of the final product, while reducing costs and environmental impact, adding value to the entire production process.
Prostech’s plasma surface treatment
Prostech understands the technical issues related to plasma surface treatment for electronic devices. We offer comprehensive solutions, including consulting and plasma treatment system. Positioned as a comprehensive supplier, Prostech is constantly striving to become a trusted partner for manufacturers around the world. Contact us by leaving your information below:
