Multi-Cure 9001-E-v3.1 encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. This encapsulant provides optimal coverage over difficult circuit geometries. 9001-E-v3.1 encapsulating material has high ionic purity, is solvent free, and isocyanate free. This encapsulant has been engineered to have a low modulus and low Tg to minimize stress on delicate wire bonds. Material exposed to light will cure in seconds, while any shadowed areas will cure upon heat exposure. 9001-E-v3.1 Visible/UV light-curable encapsulant is formulated for fast on-demand cure with the Dymax BlueWave® LED Prime UVA spot curing lamp and BlueWave® LED DX-1000 curing system.
Multi-Cure 9001-E-v3.1 encapsulant is especially well suited for chip-on-board, chip-on-flex, multi-chip modules and wire bonding.
APPLICATIONS:
- Chip-on-board
- Chip-on-flex
- Chip-on glass
- Wire bonding
- Bare-die encapsulation
| Uncured properties | |
| Solvent content | None, 100% solids |
| Isocyanate content | None |
| Chemical class | Modified urethane |
| Appearance | Liquid |
| Color | Colorless |
| Solubility | Alcohols/Chlorinated solvents/Ketones |
| Viscosity (20rpm) | 4,500 cP (nominal) |
| Cured mechanical properties | ||
| Physical | Value | Test method |
| Durometer hardness | D45 (nominal) | ASTM D2240 |
| Tensile at break, MPa [psi] | 750 psi | ASTM D638 |
| Elongation at break, % | 150% | ASTM D638 |
| Modulus of Elasticity, MPa [psi] | 2500 psi | ASTM D638 |
| Water absorption (24h) | 1.0% | ASTM D-570 |
| Boiling water absorption (2h) | 2.6% | ASTM D-570 |
| Thermal limit | 150°C | DSTM D-200* |
| Glass transition, Tg | 40°C | DSTM 256* |
| Linear shrinkage | 2% | ASTM D-2556 |