LiPOLY SP is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P, diode, triode.
FEATURE
- Thermal conductivity: 0.8 W/m*K
- Good insulator
- High recovery
- Easy to assemble
- Available in a range of thicknesses
APPLICATION
- Between CPU and heat sink
- Between a component and heat sink
- Notebook computers
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- EV electric vehicle
PROPERTY |
SP22/23/33 |
TEST METHOD |
UNIT |
Color |
Gray |
Visual |
– |
Resin base |
Silicone |
– |
– |
Thickness |
0.3 / 0.45 |
ASTM D374 |
mm |
Density |
1.8 |
ASTM D792 |
g/cm³ |
Hardness |
55 |
ASTM D2240 |
Shore A |
Application temperature |
-60~180 |
– |
°C |
ROHS & REACH |
Compliant |
– |
– |
COMPRESSION@1.0mm |
|||
Deflection @10 psi |
1 |
ASTM D5470 modify |
% |
Deflection @20 psi |
2 |
ASTM D5470 modify |
% |
Deflection @30 psi |
3 |
ASTM D5470 modify |
% |
Deflection @40 psi |
4 |
ASTM D5470 modify |
% |
Deflection @50 psi |
5 |
ASTM D5470 modify |
% |
ELECTRICAL |
|||
Dielectric breakdown |
7 / 8 |
ASTM D149 |
KV/mm |
Surface resistivity |
>10¹² |
ASTM D257 |
Ohm |
Volume resistivity |
>10¹³ |
ASTM D257 |
Ohm-m |
THERMAL@0.3mm |
|||
Thermal conductivity |
0.8 |
ASTM D5470 |
W/m*K |
Thermal impedance@10 psi |
1.110 |
ASTM D5470 |
°C-in²/ W |
Thermal impedance@20 psi |
1.058 |
ASTM D5470 |
°C-in²/ W |
Thermal impedance@30 psi |
0.988 |
ASTM D5470 |
°C-in²/ W |
Thermal impedance@40 psi |
0.929 |
ASTM D5470 |
°C-in²/ W |
Thermal impedance@50 psi |
0.897 |
ASTM D5470 |
°C-in²/ W |