LiPOLY SP is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P, diode, triode.
FEATURE
- Thermal conductivity: 0.8 W/m*K
- Good insulator
- High recovery
- Easy to assemble
- Available in a range of thicknesses
APPLICATION
- Between CPU and heat sink
- Between a component and heat sink
- Notebook computers
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- EV electric vehicle
PROPERTY | SP22/23/33 | TEST METHOD | UNIT |
Color | Gray | Visual | – |
Resin base | Silicone | – | – |
Thickness | 0.3 / 0.45 | ASTM D374 | mm |
Density | 1.8 | ASTM D792 | g/cm³ |
Hardness | 55 | ASTM D2240 | Shore A |
Application temperature | -60~180 | – | °C |
ROHS & REACH | Compliant | – | – |
COMPRESSION@1.0mm | |||
Deflection @10 psi | 1 | ASTM D5470 modify | % |
Deflection @20 psi | 2 | ASTM D5470 modify | % |
Deflection @30 psi | 3 | ASTM D5470 modify | % |
Deflection @40 psi | 4 | ASTM D5470 modify | % |
Deflection @50 psi | 5 | ASTM D5470 modify | % |
ELECTRICAL | |||
Dielectric breakdown | 7 / 8 | ASTM D149 | KV/mm |
Surface resistivity | >10¹² | ASTM D257 | Ohm |
Volume resistivity | >10¹³ | ASTM D257 | Ohm-m |
THERMAL@0.3mm | |||
Thermal conductivity | 0.8 | ASTM D5470 | W/m*K |
Thermal impedance@10 psi | 1.110 | ASTM D5470 | °C-in²/ W |
Thermal impedance@20 psi | 1.058 | ASTM D5470 | °C-in²/ W |
Thermal impedance@30 psi | 0.988 | ASTM D5470 | °C-in²/ W |
Thermal impedance@40 psi | 0.929 | ASTM D5470 | °C-in²/ W |
Thermal impedance@50 psi | 0.897 | ASTM D5470 | °C-in²/ W |
