LiPOLY N-putty series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 3.5 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It also can overcome overflow and drying problems to increase the thermal conductivity. N-putty is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot.
FEATURE
- Thermal conductivity:3.5 W/m*K
- Bond line thickness:100-1000µm
- Non-silicone resin materials
- Designed to remove manufacturing tolerances
- Does not produce stress on delicate components
- No vertical flow
- Dispensable for serial manufacture
- For any high compression and low stress application
APPLICATION
- Between CPU and heat sink
- Between a component and heat sink
- High speed mass storage drives
- Telecommunication hardware
- Flat-panel displays
- Set-top box
- IP CAM
- 5G base station & infrastructure
- EV electric vehicle
|
PROPERTY |
N-putty |
TEST METHOD |
UNIT |
|
Color |
Gray |
Visual |
– |
|
Resin base |
Non-Silicone |
– |
– |
|
Viscosity |
15000 |
DIN 53018 |
Pa.s |
|
Density |
3.0 |
ASTM D792 |
g/cm³ |
|
Application temperature |
-60~150 |
– |
°C |
|
Bond line thickness |
100~1000 |
– |
μm |
|
Shelf life |
60 months |
– |
– |
|
ROHS & REACH |
Compliant |
– |
– |
|
ELECTRICAL |
|||
|
Dielectric breakdown |
12 |
ASTM D149 |
KV/mm |
|
Volume resistivity |
>10¹³ |
ASTM D257 |
Ohm-m |
|
THERMAL |
|||
|
Thermal conductivity |
3.5 |
ASTM D5470 |
W/m*K |
|
Thermal impedance@10psi |
0.066 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@30psi |
0.059 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@50psi |
0.051 |
ASTM D5470 |
°C-in²/ W |
