JONES Thermal Gel 21-361-SP02 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is designed to be used in where large gap tolerances are present and low mechanical stress on delicate components are needed. It is ideal for filling variable gaps between multiple components and a common heat sink. JONES Thermal Gel 21-361-SP02 has a composition which yields superior thermal performance and super compliancy. This material transfers little to no pressure between interfaces. Specialized rheology allows for easy flow under pressure.
FEATURE
- Thermal Conductivity: 6.0 W/m-K
- High Reliability
- Easily Dispensable
- Pre-Cured
- Electrically Isolating
- Low Thermal Resistance
APPLICATION
- Cooling components to chassis, frame, or other mating components
- Memory modules
- Mass storage devices
- Automotive electronics
- Telecommunication hardware
- Power electronics
- LCD and PDP flat panel
- Audio and video component
- IT infrastructure
- GPS navigation and other portable devices
|
Properties |
Thermal Gel 21-361-SP02 |
Test Method |
|
|
Thermal |
Thermal Conductivity (W/m·K) |
6.0 |
ASTM D5470 |
|
Thermal Resistance (°C.cm^2/W) @1mm |
– |
ASTM D5470 |
|
|
Operating Temperature Range (°C) |
-55~150 |
JONES Test Method |
|
|
Physical |
Color |
Pink |
Visual |
|
Composition |
Ceramic & Silicone |
– |
|
|
Density (g/cc) |
3.4 |
ASTM D792 |
|
|
Flow Rate (g/min) |
25 |
90 Psi,EFD50cc @ Ø2.41mm nozzle |
|
|
Typical Minimum Bondline Thickness (mm) |
0.15 |
JONES Test Method |
|
|
Electrical |
Breakdown Voltage (KV AC /mm) |
> 6 |
ASTM D149 |
|
Volume Resistivity (Ohm·cm) |
10^13 |
ASTM D257 |
|
|
Dielectric Constant @1MHz |
11.0 |
ASTM D150 |
|
|
Regulatory |
Flammability Rating |
V0 |
UL 94 |
