JONES Thermal Gel 21-340-SP01 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is designed to be used in where large gap tolerances presently and low mechanical stress on delicate components . It is ideal for filling variable gaps between multiple components and a common heat sink.
FEATURES AND BENEFITS
Thermal Conductivity: 3.5 W/m-K｜Soft and Compliant Transferring Little To No Pressure Between Interfaces｜Pre-Cured｜Electrically Isolating｜Low Thermal Resistance｜Easily DispensableRegulatory｜
APPLICATIONS
Cooling components to chassis, frame, or other mating components｜Memory modules｜Mass storage devices｜Automotive electronics｜ Telecommunication hardware｜Power electronics｜LCD and PDP Gat panel｜Audio and video component｜IT infrastructure｜GPS navigation and other portable devices.
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21-340-SP01 TYPICAL PROPERTIES |
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Properties |
Typical Properties |
Test Method |
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Thermal |
Thermal Conductivity (W/m·K) |
3.5 |
ASTM D5470 |
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Thermal Resistance (°C.cm^2/W) @1mm |
/ |
ASTM D5470 |
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Operating Temperature Range (°C) |
-55~150 |
JONES Test Method |
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Physical |
Color |
Green |
Visual |
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Composition |
Ceramic & Silicone |
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Density (g/cc) |
3.2 |
ASTM D792 |
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Flow Rate (g/min) |
48 |
90 Psi,EFD180cc @ Ø 3.17mm nozzle |
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Typical Minimum Bondline Thickness (mm) |
0.10 |
JONES Test Method |
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Electrical |
Breakdown Voltage (KV AC /mm) |
>5 |
ASTM D149 |
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Volume Resistivity (Ohm·cm) |
10^13 |
ASTM D257 |
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Dielectric Constant @1MHz |
5.0 |
ASTM D150 |
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Regulatory |
Flammability Rating |
V0 |
UL94 |
