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JONES 21-340-SP01 Single Part Thermal Gel

  • Product code: 21-340-SP01
  • Manufacturer: Jones Tech
  • Package size: 30cc Cartridge (80 g)
  • Shelf Life: 18 months

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JONES Thermal Gel 21-340-SP01 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is designed to be used in where large gap tolerances presently and low mechanical stress on delicate components . It is ideal for filling variable gaps between multiple components and a common heat sink.

FEATURES AND BENEFITS

Thermal Conductivity: 3.5 W/m-K｜Soft and Compliant Transferring Little To No Pressure Between Interfaces｜Pre-Cured｜Electrically Isolating｜Low Thermal Resistance｜Easily DispensableRegulatory｜

APPLICATIONS

Cooling components to chassis, frame, or other mating components｜Memory modules｜Mass storage devices｜Automotive electronics｜ Telecommunication hardware｜Power electronics｜LCD and PDP Gat panel｜Audio and video component｜IT infrastructure｜GPS navigation and other portable devices.

 

21-340-SP01 TYPICAL PROPERTIES

 

Properties

Typical Properties

Test Method

 

Thermal

Thermal Conductivity (W/m·K)

3.5

ASTM D5470

Thermal Resistance (°C.cm^2/W) @1mm

/

ASTM D5470

Operating Temperature Range (°C)

-55~150

JONES Test Method

 

 

 

Physical

Color

Green

Visual

Composition

Ceramic & Silicone

/

Density (g/cc)

3.2

ASTM D792

Flow Rate (g/min)

48

90 Psi,EFD180cc @ Ø 3.17mm nozzle

Typical Minimum Bondline Thickness (mm)

0.10

JONES Test Method

 

Electrical

Breakdown Voltage (KV AC /mm)

>5

ASTM D149

Volume Resistivity (Ohm·cm)

10^13

ASTM D257

Dielectric Constant @1MHz

5.0

ASTM D150

Regulatory

Flammability Rating

V0

UL94

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