Why Potting and Encapsulating help to increase manufacturing productivity and to save cost?
Potting is always known as a simple and cost-effective way to increase the reliability and durability of many components and systems especially in electronics and LED lighting industries.
Using potting compound for effective potting of electronics to protect against environmental influences, improve not only mechanical strength but also high electrical insulation. Potting materials are a permanent protective solution which will remain as an integral part of the unit to protect the electronic assembly while providing numerous benefits:
♦ Electrical Insulation
♦ Enhanced Mechanical Strength
♦ Heat dissipation
♦ Vibration/shock resistance
♦ Corrosion protection
♦ Chemical protection
♦ Environmental influences
Going along with increase the durability of potting part, manufacturing cost would be optimized for the most effective manufacturing process:
♦ Reduce the cost to repair/ rework components
♦ Automatic potting system help to reduce labor cost
♦ Application of updated technology to increase product added value, increase revenue
What have to take into consideration when talking about potting process?
There are two main effects which have to be taken notice in potting process as following:
Potting process
How is potting process done? That depends on the type and use of the components to be potted
On the chemical side, some surfaces may have chemical reactions with certain potting materials, potentially resulting in non-bonded areas. These must be identified so that the proper potting compounds will be used or have to apply the appropriate pretreatment method. On the electrical side, some parts or components may be inadequately sealed so that potting material may go where it is not supposed to go. Such components must be identified to avoid malfunction later on.
Different potting compounds require different processing. They may require special mixing, different temperatures, different ways to eliminate bubbles, and different curing to minimize shrinkage. Bubble elimination (or “degassing”) may require vacuum chambers. For certain complicated potting projects, higher viscosity of the potting material is required and that’s achieved via elevated temperatures.
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