• Products
    • By Application
      • Abrasives
      • Adhesives
      • Cleaner Degreaser
      • Component Reinforcement
      • Conformal Coatings
      • Curing System
      • Dispensing System
      • Elastomeric materials
      • EMI Shielding
      • Impregnating resin
      • Labelling Printing
      • Low Pressure Molding Material
      • Masking
      • Metrology Equipment
      • Other Industrial Materials
      • Plasma Treatment
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Robotic & Automation
      • Sealant & Gasketing Liquid
      • Soldering
      • Tape
      • Thermal Management
    • By Market
      • Battery
      • Consumer Products
      • Electrical
      • Electronics
      • General Industrial
      • Handphone
      • Lighting
      • Medical
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Transportation
    • By Manufacturer
      • 3M
      • AETP
      • Almit
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Dymax
      • Elantas
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Hexagon
      • Huntsman
      • ITW Performance Polymers
      • Jowat
      • Kuka
      • Lamieux
      • Markem imaje
      • Medmix
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • RedRing Solder
      • Rogers
      • Shenmao
      • Shenzhen HFC
      • Stockmeier
      • Sulzer
      • T-Global
      • Techspray
      • Vietape
      • Weldtone
  • Solutions
    • 2K Meter-mixing and Dispensing System
    • 3M Novec Alternative
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Conformal Coating Solution
    • EMI Shielding Solutions
    • Industrial Adhesive
      • Anaerobic Adhesive Solutions
      • Sealing & Gasketing
      • Structural Bonding Adhesive Solutions
    • Liquid Media Curing
    • Low Pressure Molding Solutions
    • Potting – Encapsulation Solutions
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
    • Thermal Interface Materials Solutions
  • Industries
    • Automotive Industry
    • Battery Energy Storage System (BESS)
    • Construction
    • Electronics Industry
    • Furniture & Building Construction
    • Image Sensor & Camera Module
    • Medical
    • Motor Industry
    • Printed Circuit Board Solutions
    • Speaker
    • Sports and Fashion
    • Transformer
  • Resource
    • Blog
    • Glossary
    • Library
    • Video
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Abrasives
      • Adhesives
      • Cleaner Degreaser
      • Component Reinforcement
      • Conformal Coatings
      • Curing System
      • Dispensing System
      • Elastomeric materials
      • EMI Shielding
      • Impregnating resin
      • Labelling Printing
      • Low Pressure Molding Material
      • Masking
      • Metrology Equipment
      • Other Industrial Materials
      • Plasma Treatment
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Robotic & Automation
      • Sealant & Gasketing Liquid
      • Soldering
      • Tape
      • Thermal Management
    • By Market
      • Battery
      • Consumer Products
      • Electrical
      • Electronics
      • General Industrial
      • Handphone
      • Lighting
      • Medical
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Transportation
    • By Manufacturer
      • 3M
      • AETP
      • Almit
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Dymax
      • Elantas
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Hexagon
      • Huntsman
      • ITW Performance Polymers
      • Jowat
      • Kuka
      • Lamieux
      • Markem imaje
      • Medmix
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • RedRing Solder
      • Rogers
      • Shenmao
      • Shenzhen HFC
      • Stockmeier
      • Sulzer
      • T-Global
      • Techspray
      • Vietape
      • Weldtone
  • Solutions
    • 2K Meter-mixing and Dispensing System
    • 3M Novec Alternative
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Conformal Coating Solution
    • EMI Shielding Solutions
    • Industrial Adhesive
      • Anaerobic Adhesive Solutions
      • Sealing & Gasketing
      • Structural Bonding Adhesive Solutions
    • Liquid Media Curing
    • Low Pressure Molding Solutions
    • Potting – Encapsulation Solutions
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
    • Thermal Interface Materials Solutions
  • Industries
    • Automotive Industry
    • Battery Energy Storage System (BESS)
    • Construction
    • Electronics Industry
    • Furniture & Building Construction
    • Image Sensor & Camera Module
    • Medical
    • Motor Industry
    • Printed Circuit Board Solutions
    • Speaker
    • Sports and Fashion
    • Transformer
  • Resource
    • Blog
    • Glossary
    • Library
    • Video
  • Contact
  • en
  • vi
  • cn
Home > Products > By Manufacturer > Henkel > BERGQUIST® GAP PAD® TGP HC5000

BERGQUIST® GAP PAD® TGP HC5000

  • Product code: TGP HC5000
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 month

Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

Highly Conformable, Thermally Conductive, Low-Modulus Material

BERGQUIST GAP PAD TGP HC5000 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. BERGQUIST GAP PAD TGP HC5000 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC5000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC5000 is supplied with protective liners on both sides.

FEATURES:

  • Thermal conductivity: 5.0 W/m-K
  • High-compliance, low compression stress
  • Fiberglass reinforced for shear and tear resistance

APPLICATIONS:

  • Telecommunications
  • ASICs and DSPs
  • Consumer electronics
  • Thermal modules to heat sinks

 

 

PROPERTY    IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Violet Violet Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (in.) / (mm) 0.020, 0.040, 0.060
0.080, 0.100, 0.125
0.508, 1.016, 1.524,
2.032, 2.540, 3.175
 ASTM D374
Inherent Surface Tack (1-sided) 2 2 —
Density, Bulk, Rubber (g/cc) 3.2 3.2 ASTM D792
Heat Capacity ( J/g-K) 1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) 35 35 ASTM D2240
Young’s Modulus (psi) / (kPa) 17.5 121 ASTM D575
Continuous Use Temp. (°F) / (°C) -76 to 392 -60 to 200 —
Dielectric Breakdown Voltage (VAC) 5,000 5,000 ASTM D149
Dielectric Constant (1,000 Hz) 8.0 8.0 ASTM D150
Volume Resistivity (Ω-m) 10^11 10^11 ASTM D257
Flame Rating V-O V-O UL 94
Thermal Conductivity (W/m-K) 5.0 5.0 ASTM D5470

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    Outstanding Feature Product Group

    • BERGQUIST® GAP PAD® TGP HC5000
    • TGP HC5000
    • Thermally Conductive pad
    BERGQUIST® GAP PAD® TGP HC5000

      Leave your information via Form, our Technical Support Team will contact you shortly!

      BERGQUIST® GAP PAD® TGP HC5000

        Leave your information via Form, our Technical Support Team will contact you shortly!

        BERGQUIST® GAP PAD® TGP HC5000

          Leave your information via Form, our Technical Support Team will contact you shortly!

          BERGQUIST® GAP PAD® TGP HC5000

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            follow us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!