Product description of Bectron® MR 3406
Bectron® MR 3406 is a one-component hot melt resin thick film coating developed for electronic applications. It is based on polyolefin resin chemistry which is better suited to electronics than conventional polyamide based hot-melt thermoplastic. As a thermoplastic there is no curing reaction only a rapid solidification of the resin on cooling.
Application of Bectron® MR 3406
Bectron® MR 3406 dielectric properties are ideal for electronic applications as well as protection against humidity, corrosion vibration and migration. It is suitable for application of a thick film coating on PCBs and components to provide chemical protection and/or mechanical support to secure them against shock and vibration. It can be placed selectively to secure and protect single components or for whole PCBs or hybrids. Bectron® MR 3406 is recommended for serial production where fast solidification gives a short process time requiring no curing oven.
Properties of Bectron® MR 3406 in cured material
The tough plastic resin MR 3406 has a maximum operating temperature of 120°C. It has excellent di[1]electric properties and shows very good adhesive strength on many different substrates over the temperature range from -40 °C to 120°C. It has low humidity absorption providing stable dielectric properties even after water immersion. Resistant to acids and bleach, polar solvents and fungal growth Not resistant to aliphatic aromatic and chlorinated solvents Very easy re-work as it can be melted and hardened reversibly Satisfies requirements of ROHS.
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Properties of component as supplied
Property |
Condition |
Value |
Unit |
Viscosity (DIN 53018) |
180°C |
520 ± 200 |
mPas |
Density (DIN 53217) |
23°C |
0.86 ± 0.02 |
g/cm³ |
Shelf life |
23°C |
6 |
months |
Thermal properties in cured condition
Property |
Value |
Unit |
Melting Point |
140 |
°C |
Temperature Range |
-40 to +120 |
°C |
Mechanical properties in cured condition
Property |
Condition |
Value |
Unit |
Shore hardness (ISO 868) |
23°C |
14 ± 4 |
Shore A |