3M 2538 is a specially formulated olefin hybrid hot melt adhesive possesses excellent high temperature resistance and low slump during processing. It removes cleanly from various electronic substrates by peeling even after 10 min @ 260°C ( 500°F). Non-silicone adhesives formulation lessen the potential for silicone contamination which can interfere with subsequent bonding or conforming coating process. These high temperature resistance adhesives also has excellent chemical resistance and should be considered for demanding chemical masking applications.
FEATURES:
- Excellent Conformability upon Dispensing
- High Temperature Stable @ 260C Reflow Condition
- High Temperature Slump Resistance
- Clean Removal
- Good Chemical Resistance
- Fast Process Time
- Stable Dielectric Properties
- Silicone Free
APPLICATIONS:
- Protection of sensitive areas and component on printed circuit boards during conformal coating processes
- Masking and sealing of electronic components
| Adhesive | Olefin Hybrid |
| Color | Translucent |
| Viscosity at 150°C | 240 Pa·s |
| Hardness (Shore A) | 20 |
| Tensile Elongation | >700% |
| Glass Transition Temperature | -51°C |
| Surface Resistivity | 1.6E14 ohm/sq |
| Volume Resistivity | >1.0E16 ohm-cm |
| Dielectric Constant (9 – 25 GHz) | 2.3 |
| Breakdown Voltage | 38 KV/mm |
