3M 2538 is a specially formulated olefin hybrid hot melt adhesive possesses excellent high temperature resistance and low slump during processing. It removes cleanly from various electronic substrates by peeling even after 10 min @ 260°C ( 500°F). Non-silicone adhesives formulation lessen the potential for silicone contamination which can interfere with subsequent bonding or conforming coating process. These high temperature resistance adhesives also has excellent chemical resistance and should be considered for demanding chemical masking applications.
FEATURES:
Excellent Conformability upon Dispensing
High Temperature Stable @ 260C Reflow Condition
High Temperature Slump Resistance
Clean Removal
Good Chemical Resistance
Fast Process Time
Stable Dielectric Properties
Silicone Free
APPLICATIONS:
Protection of sensitive areas and component on printed circuit boards during conformal coating processes
