The camera module industry has come into focus as smartphone, tablet & vision systems in automotive manufacturers continue to develop advanced camera module technologies, capitalizing on this sector’s fast growth. Pros Technology is confident to provide our beloved customers with high-quality and reasonable price materials which would help optimize the camera manufacturing process’s performance.
Importance of underfill in Camera Module
- To safeguard flip-chip image die applications, side fill underfill is the material of choice to ensure bump reinforcement during reliability testing and while in use.
- The capability of the underfill is critical, with controlled flow essential to material containment and to avoiding image sensor contamination.
- In addition to the flip-chip reinforcement, underfill is also used to protect the connection of the camera module to the PCB.
Key Material Properties
-
Controlled flow
-
High thixotropic index
-
Good bump coverage
-
Good fillet capability
-
Low-temperature cure
-
Long pot life
-
Low halogen / RoHS-compliant
Related Products
A leader in underfill material development for the semiconductor and electronics assembly markets, we have a portfolio of camera module underfills that delivers outstanding adhesion and protection with the flexibility required to accommodate stress.
CAMERAL MODULE – UNDERFILL ADHESIVES FOR FLIP-CHIP
Do not hesitate to contact us for more information about products and our specific solutions: