Products - PROSTECH

JC 823-6 Epoxy for BGA-CSP Under-fill

https://prostech.vn/jc-823-6-epoxy-for-bga-csp-under-fill/

This product is a one component epoxy and can rework adhesive for electronic devices bonding. This product is easy to

Hot melt PUR LOCTITE HHD 3542

https://prostech.vn/hot-melt-pur-loctite-hhd-3542/

LOCTITE HHD 3542, Polyurethane Hot Melt, Reactive, Long open time, Solidification and Moisture LOCTITE® HHD 3542 is a reactive hot-melt

Everwide JD 642-6 Epoxy for BGA – CSP Underfill

https://prostech.vn/everwide-jd-642-6-epoxy-for-bga-csp-under-fill/

JD642-6 is one component epoxy adhesive for electronic devices bonding. This product is easy to operate and suited for various

3M™ Thermal Bonding Film AF42

https://prostech.vn/3m-thermal-bonding-film-af42/

3M™ Thermal Bonding Film AF42 is an epoxy, thermoset film adhesive developed for structural bonding of metal, glass and other

3M™ Thermal Bonding Film AF111

https://prostech.vn/3m-thermal-bonding-film-af111/

3M™ Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic

3M VHB Architectural Panel Tape B11F

https://prostech.vn/3m-vhb-architectural-panel-tape-b11f/

Dream, Design, Deliver with our 3M™ VHB™ Architectural Panel Tape B11F. It is a black, 0.045 in. (1.1 mm), multi-purpose

3M VHB Architectural Panel Tape B16F

https://prostech.vn/3m-vhb-architectural-panel-tape-b16f/

3M™ VHB™ Architectural Panel Tapes are durable, high performance double-sided pressure sensitive acrylic foam tapes. These tapes have been used